Abstract: A secondary illumination optic, principally directed toward managing light from light emitting diode illumination sources having a primary optical element, is provided comprising a lens combination arranged along the optical axis, a central convex lens portion being centrally positioned on the optical axis, and a surrounding total internal reflection lens portion, with the central optic having a first and incident surface and a second and exiting surface, both comprising refractive faceted optical lens elements, and the total internal reflection optic lens portion having a cylinder shaped aspheric first and incident surface, a second and internal total reflection surface, and a third and exiting surface comprising refractive faceted optic lens elements, wherein, being constructed of resin having optical characteristic, the central and total internal reflection lens portions are molded as an integrated assembly from an optical resin providing a stepped tulip type lens, thinner and higher yielding than prior ar

Abstract: A camera module includes a gradient index lens on a spacer plate attached over an array of pixel sensors and associated micro lenses. The spacer plate and gradient index lens can be formed at the wafer level during the manufacture of multiple camera modules. A process for manufacturing the camera modules thus provides tolerances and yields provided by wafer processing techniques rather than mechanical assembly.

Abstract: A camera module includes a gradient index lens on a spacer plate attached over an array of pixel sensors and associated micro lenses. The spacer plate and gradient index lens can be formed at the wafer level during the manufacture of multiple camera modules. A process for manufacturing the camera modules thus provides tolerances and yields provided by wafer processing techniques rather than mechanical assembly.

Abstract: A camera module includes a gradient index lens on a spacer plate attached over an array of pixel sensors and associated micro lenses. The spacer plate and gradient index lens can be formed at the wafer level during the manufacture of multiple camera modules. A process for manufacturing the camera modules thus provides tolerances and yields provided by wafer processing techniques rather than mechanical assembly.

Abstract: An imaging device such as a CMOS image sensor has a cover attached to a standoff surrounding a micro-lens array. Standard wafer processing fabricates the standoff (e.g., out of photoresist) and attaches the cover. The standoff maintains a gap over the micro-lenses. An adhesive attaches the cover to the standoff and can be kept away from the micro-lenses by a barrier having a structure similar to the standoff. Particles in the adhesive can prevent the adhesive from squeezing out from between the cover and the standoff during attachment. The standoff (and barrier if present) can provide a vent to prevent pressure in the gap from causing distortion or damage. The shape of the vent can prevent particles from entering the gap. Cutting the attached cover exposes electrical connections and can use preformed grooves in the cover to allow cutting of the cover without damaging underlying circuit elements.

Abstract: An imaging device such as a CMOS image sensor has a cover attached to a standoff surrounding a micro-lens array. Standard wafer processing fabricates the standoff (e.g., out of photoresist) and attaches the cover. The standoff maintains a gap over the micro-lenses. An adhesive attaches the cover to the standoff and can be kept away from the micro-lenses by a barrier having a structure similar to the standoff. Particles in the adhesive can prevent the adhesive from squeezing out from between the cover and the standoff during attachment. The standoff (and barrier if present) can provide a vent to prevent pressure in the gap from causing distortion or damage. The shape of the vent can prevent particles from entering the gap. Cutting the attached cover exposes electrical connections and can use preformed grooves in the cover to allow cutting of the cover without damaging underlying circuit elements.

Abstract: An imaging device such as a CMOS image sensor has a cover attached to a standoff surrounding a micro-lens array. Standard wafer processing fabricates the standoff (e.g., out of photoresist) and attaches the cover. The standoff maintains a gap over the micro-lenses. An adhesive attaches the cover to the standoff and can be kept away from the micro-lenses by a barrier having a structure similar to the standoff. Particles in the adhesive can prevent the adhesive from squeezing out from between the cover and the standoff during attachment. The standoff (and barrier if present) can provide a vent to prevent pressure in the gap from causing distortion or damage. The shape of the vent can prevent particles from entering the gap. Cutting the attached cover exposes electrical connections and can use preformed grooves in the cover to allow cutting of the cover without damaging underlying circuit elements.

Abstract: A camera module includes a gradient index lens on a spacer plate attached over an array of pixel sensors and associated micro lenses. The spacer plate and gradient index lens can be formed at the wafer level during the manufacture of multiple camera modules. A process for manufacturing the camera modules thus provides tolerances and yields provided by wafer processing techniques rather than mechanical assembly.

Abstract: An imaging device such as a CMOS image sensor has a cover attached to a standoff surrounding a micro-lens array. Standard wafer processing fabricates the standoff (e.g., out of photoresist) and attaches the cover. The standoff maintains a gap over the micro-lenses. An adhesive attaches the cover to the standoff and can be kept away from the micro-lenses by a barrier having a structure similar to the standoff. Particles in the adhesive can prevent the adhesive from squeezing out from between the cover and the standoff during attachment. The standoff (and barrier if present) can provide a vent to prevent pressure in the gap from causing distortion or damage. The shape of the vent can prevent particles from entering the gap. Cutting the attached cover exposes electrical connections and can use preformed grooves in the cover to allow cutting of the cover without damaging underlying circuit elements.

Abstract: Socketable flexible circuit based electronic device modules and sockets for electrically and mechanically connecting the electronic device modules to an interconnect substrate are described. The systems provide ways in which the electronic device module may be positioned accurately and securely on an interconnect carrier, while allowing the electronic device modules to be replaced easily without having to resort to laborious desoldering and resoldering operations to remove the modules and connect new modules in their place.

Abstract: Fine pulse width modulation (PWM) adjustments in the output of a laser printer are accomplished by receiving values from a bit map and modifying the values in accordance with values in a lookup table (LUT). The lookup table is subdivided into a plurality of blocks, and a selection of the blocks is made in accordance with external values. This allows the output of a pulse width modulation circuit to be adjusted to a precision that is greater than that afforded by the bit size of the values from the bit map. The use of plural blocks in the lookup table permits adjustments in the output of the pulse width modulation circuit in accordance with external factors such as relative humidity, sensitivity of an optical photoreceptor, and developer life.

Abstract: A latent image is developed in the photoconductor surface of a moving belt by displacing the belt from its path of movement toward an adjacent stationary electrophotographic developer as the latent image approaches that developer, to establish a toner transfer gap therebetween, where toner is transferred from the developer to the photoconductor as the latent image passes the developer. Electromagnetically or pneumatically operated mechanisms are employed to displace the belt.