Patents by Inventor David Sawoska

David Sawoska has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • UV inkjet resist
    Publication number: 20080308003
    Abstract: A UV curable, etch-resistant ink composition for ink jet printing of variable information on printed circuit boards and for printing the circuit boards themselves. The ink composition of the invention includes a novel thermal stabilizer for preventing the ink composition from hardening and gelling in the print head when heated.
    Type: Application
    Filed: June 13, 2007
    Publication date: December 18, 2008
    Inventors: Andrew M. Krol, John Ganjei, David Sawoska
  • Method for the manufacture of printed circuit boards with plated resistors
    Publication number: 20080003351
    Abstract: A process is revealed whereby resistors can be manufactured integral with a printed circuit board by plating the resistors onto the insulative substrate. Uniformization of the insulative substrate through etching and oxidation of the plated resistor are discussed as techniques for improving the uniformity and consistency of the plated resistors. Trimming and baking are also disclosed as methods for adjusting and stabilizing the resistance of the plated resistors.
    Type: Application
    Filed: September 4, 2007
    Publication date: January 3, 2008
    Applicant: MacDermid, Incorporated
    Inventors: Peter Kukanskis, Dennis Fritz, Frank Durso, Steven Castaldi, David Sawoska
  • Process for creating a pattern on a copper surface
    Publication number: 20070237899
    Abstract: A process for printing inks or organic resists using a droplet discharge printing mechanism onto a copper or copper alloy surface with increased resolution is described. The increased resolution is achieved by first preferably microetching the surface and then treating the copper surface with an organic substance which is capable of lowering the surface energy of the copper surface or capable of making the copper surface more hydrophobic prior to printing thereon. The process is useful in the manufacture of electronic circuits.
    Type: Application
    Filed: April 5, 2006
    Publication date: October 11, 2007
    Inventors: David Sawoska, Andrew Krol, Steven Castaldi
  • Method for the manufacture of printed circuit boards with plated resistors
    Patent number: 7279108
    Abstract: A process is revealed whereby resistors can be manufactured integral with a printed circuit board by plating the resistors onto the insulative substrate. Uniformization of the insulative substrate through etching and oxidation of the plated resistor are discussed as techniques for improving the uniformity and consistency of the plated resistors. Trimming and baking are also disclosed as methods for adjusting and stabilizing the resistance of the plated resistors.
    Type: Grant
    Filed: February 6, 2006
    Date of Patent: October 9, 2007
    Inventors: Peter Kukanskis, Dennis Fritz, Frank Durso, Steven Castaldi, David Sawoska
  • Method for enhancing the solderability of a surface
    Patent number: 7267259
    Abstract: A method for enhancing the solderability of a metallic surface is disclosed where the metallic surface is plated with an immersion silver plate prior to soldering, which immersion silver plate is treated with an additive selected from the group consisting of fatty amines, fatty amides, quaternary salts, amphateric salts, resinous amines, resinous amides, fatty acids, resinous acids, ethoxylated derivatives of any of the foregoing, and mixtures of any of the foregoing. The immersion silver deposits created are resistant to electromigration.
    Type: Grant
    Filed: June 6, 2003
    Date of Patent: September 11, 2007
    Inventors: Ronald Redline, David Sawoska, Peter Kukanskis
  • Method for the manufacture of printed circuit boards with plated resistors
    Publication number: 20060124583
    Abstract: A process is revealed whereby resistors can be manufactured integral with a printed circuit board by plating the resistors onto the insulative substrate. Uniformization of the insulative substrate through etching and oxidation of the plated resistor are discussed as techniques for improving the uniformity and consistency of the plated resistors. Trimming and baking are also disclosed as methods for adjusting and stabilizing the resistance of the plated resistors.
    Type: Application
    Filed: February 6, 2006
    Publication date: June 15, 2006
    Applicant: MacDermid, Incorporated
    Inventors: Peter Kukanskis, Dennis Fritz, Frank Durso, Steven Castaldi, David Sawoska
  • Method for the manufacture of printed circuit boards with plated resistors
    Patent number: 7034231
    Abstract: A process is revealed whereby resistors can be manufactured integral with a printed circuit board by plating the resistors onto the insulative substrate. Uniformization of the insulative substrate through etching and oxidation of the plated resistor are discussed as techniques for improving the uniformity and consistency of the plated resistors. Trimming and baking are also disclosed as methods for adjusting and stabilizing the resistance of the plated resistors.
    Type: Grant
    Filed: April 21, 2003
    Date of Patent: April 25, 2006
    Inventors: Peter Kukanskis, Dennis Fritz, Frank Durso, Steven Castaldi, David Sawoska
  • Method for enhancing the solderability of a surface
    Patent number: 6905587
    Abstract: A method for enhancing the solderability of a metallic surface is disclosed where the metallic surface is plated with an immersion silver plate prior to soldering, which immersion silver plate is treated with an additive selected from the group consisting of fatty amines, fatty amides, quaternary salts, amphateric salts, resinous amines, resinous amides, fatty acids, resinous acids, ethoxylated derivatives of any of the foregoing, and mixtures of any of the foregoing. The immersion silver deposits created are resistant to electromigration.
    Type: Grant
    Filed: January 14, 2003
    Date of Patent: June 14, 2005
    Inventors: Ronald Redline, David Sawoska, Peter Kukanskis
  • Method for the manufacture of printed circuit boards with embedded resistors
    Publication number: 20040245210
    Abstract: A process is revealed whereby resistors can be manufactured integral with a circuit board by printing the resistors onto the insulative substrate. Uniformization of the insulative substrate through etching is discussed as a technique for improving the uniformity and consistency of the printed resistors. Trimming and baking are also disclosed as methods for adjusting and stabilizing the resistance of the printed resistors.
    Type: Application
    Filed: June 9, 2003
    Publication date: December 9, 2004
    Inventors: Peter Kukanskis, Frank Durso, Steven Castaldi, David Sawoska
  • Method for the manufacture of printed circuit boards with integral plated resistors
    Patent number: 6767445
    Abstract: The present invention is a process for manufacturing resistors integral with the printed circuit board by plating the resistors onto the insulative substrate. The invention uses a mask during the activation step so as to selectively activate only selected portions of the surface thus enabling smaller areas to be plated on the printed circuit board because no plating mask is used. The process of the instant invention produced printed circuit boards having greater uniformity and reliability as compared to the prior art.
    Type: Grant
    Filed: October 16, 2002
    Date of Patent: July 27, 2004
    Inventors: Peter Kukanskis, Frank Durso, David Sawoska
  • Method for the manufacture of printed circuit boards with integral plated resistors
    Publication number: 20040076743
    Abstract: The present invention is a process for manufacturing resistors integral with the printed circuit board by plating the resistors onto the insulative substrate. The invention uses a mask during the activation step so as to selectively activate only selected portions of the surface thus enabling smaller areas to be plated on the printed circuit board because no plating mask is used. The process of the instant invention produced printed circuit boards having greater uniformity and reliability as compared to the prior art.
    Type: Application
    Filed: October 16, 2002
    Publication date: April 22, 2004
    Inventors: Peter Kukanskis, Frank Durso, David Sawoska
  • Method for enhancing the solderability of a surface
    Publication number: 20030209446
    Abstract: A method for enhancing the solderability of a metallic surface is disclosed where the metallic surface is plated with an immersion silver plate prior to soldering, which immersion silver plate is treated with an additive selected from the group consisting of fatty amines, fatty amides, quaternary salts, amphateric salts, resinous amines, resinous amides, fatty acids, resinous acids, ethoxylated derivatives of any of the foregoing, and mixtures of any of the foregoing. The immersion silver deposits created are resistant to electromigration.
    Type: Application
    Filed: June 6, 2003
    Publication date: November 13, 2003
    Applicant: MacDermid Incorporated
    Inventors: Ronald Redline, David Sawoska, Peter Kukanskis
  • Method for the manufacture of printed circuit boards with plated resistors
    Publication number: 20030205551
    Abstract: A process is revealed whereby resistors can be manufactured integral with a printed circuit board by plating the resistors onto the insulative substrate. Uniformization of the insulative substrate through etching and oxidation of the plated resistor are discussed as techniques for improving the uniformity and consistency of the plated resistors. Trimming and baking are also disclosed as methods for adjusting and stabilizing the resistance of the plated resistors.
    Type: Application
    Filed: April 21, 2003
    Publication date: November 6, 2003
    Applicant: MacDermid, Incorporated
    Inventors: Peter Kukanskis, Dennis Fritz, Frank Durso, Steven Castaldi, David Sawoska
  • Method for the manufacture of printed circuit boards with plated resistors
    Patent number: 6585904
    Abstract: A process is revealed whereby resistors can be manufactured integral with a printed circuit board by plating the resistors onto the insulative substrate. Uniformization of the insulative substrate through etching and oxidation of the plated resistor are discussed as techniques for improving the uniformity and consistency of the plated resistors. Trimming and baking are also disclosed as methods for adjusting and stabilizing the resistance of the plated resistors.
    Type: Grant
    Filed: February 15, 2001
    Date of Patent: July 1, 2003
    Inventors: Peter Kukanskis, Dennis Fritz, Frank Durso, Steven Castaldi, David Sawoska
  • Method for enhancing the solderability of a surface
    Publication number: 20030118742
    Abstract: A method for enhancing the solderability of a metallic surface is disclosed where the metallic surface is plated with an immersion silver plate prior to soldering, which immersion silver plate is treated with an additive selected from the group consisting of fatty amines, fatty amides, quaternary salts, amphateric salts, resinous amines, resinous amides, fatty acids, resinous acids, ethoxylated derivatives of any of the foregoing, and mixtures of any of the foregoing. The immersion silver deposits created are resistant to electromigration.
    Type: Application
    Filed: January 14, 2003
    Publication date: June 26, 2003
    Applicant: MacDermid, Incorporated
    Inventors: Ronald Redline, David Sawoska, Peter Kukanskis
  • Method for enhancing the solderability of a surface
    Patent number: 6544397
    Abstract: A method for enhancing the solderability of a metallic surface is disclosed where the metallic surface is plated with an immersion silver plate prior to soldering, which immersion silver plate is treated with an additive selected from the group consisting of fatty amines, fatty amides, quaternary salts, amphateric salts, resinous amines, resinous amides, fatty acids, resinous acids, ethoxylated derivatives of any of the foregoing, and mixtures of any of the foregoing. The immersion silver deposits created are resistant to electromigration.
    Type: Grant
    Filed: March 29, 2001
    Date of Patent: April 8, 2003
    Inventors: Ronald Redline, David Sawoska, Peter Kukanskis
  • Method for the manufacture of printed circuit boards with plated resistors
    Publication number: 20020135459
    Abstract: A process is revealed whereby resistors can be manufactured integral with a printed circuit board by plating the resistors onto the insulative substrate. Uniformization of the insulative substrate through etching and oxidation of the plated resistor are discussed as techniques for improving the uniformity and consistency of the plated resistors. Trimming and baking are also disclosed as methods for adjusting and stabilizing the resistance of the plated resistors.
    Type: Application
    Filed: February 15, 2001
    Publication date: September 26, 2002
    Inventors: Peter Kukanskis, Dennis Fritz, Frank Durso, Steven Castaldi, David Sawoska
  • Method for enhancing the solderability of a surface
    Patent number: RE45297
    Abstract: A method for enhancing the solderability of a metallic surface is disclosed where the metallic surface is plated with an immersion silver plate prior to soldering, which immersion silver plate is treated with an additive selected from the group consisting of fatty amines, fatty amides, quaternary salts, amphateric salts, resinous amines, resinous amides, fatty acids, resinous acids, ethoxylated derivatives of any of the foregoing, and mixtures of any of the foregoing. The immersion silver deposits created are resistant to electromigration.
    Type: Grant
    Filed: February 13, 2012
    Date of Patent: December 23, 2014
    Inventors: Ronald Redline, David Sawoska, Peter Kukanskis, Donald Ferrier, Eric Yakobson
  • Method for enhancing the solderability of a surface
    Patent number: RE45842
    Abstract: A method for enhancing the solderability of a metallic surface is disclosed where the metallic surface is plated with an immersion silver plate prior to soldering, which immersion silver plate is treated with an additive selected from the group consisting of fatty amines, fatty amides, quaternary salts, amphateric salts, resinous amines, resinous amides, fatty acids, resinous acids, ethoxylated derivatives of any of the foregoing, and mixtures of any of the foregoing. The immersion silver deposits created are resistant to electromigration.
    Type: Grant
    Filed: May 3, 2012
    Date of Patent: January 12, 2016
    Inventors: Ronald Redline, David Sawoska, Peter Kukanskis, Donald Ferrier, Eric Yakobson
  • Method for enhancing the solderability of a surface
    Patent number: RE45881
    Abstract: A method for enhancing the solderability of a metallic surface is disclosed where the metallic surface is plated with an immersion silver plate prior to soldering, which immersion silver plate is treated with an additive selected from the group consisting of fatty amines, fatty amides, quaternary salts, amphateric salts, resinous amines, resinous amides, fatty acids, resinous acids, ethoxylated derivatives of any of the foregoing, and mixtures of any of the foregoing. The immersion silver deposits created are resistant electromigration.
    Type: Grant
    Filed: May 3, 2012
    Date of Patent: February 9, 2016
    Inventors: Ronald Redline, David Sawoska, Peter Kukanskis, Donald Ferrier, Eric Yakobson