Abstract: A laser machining method includes defining at least one threshold value S0 with respect to a light-intensity-dependent first process variable F in at least one working range KAB or at a working point KAP, detecting a light-intensity-independent second process variable K during operation of a laser machine tool in the at least one working range KAB or at the working point KAP, determining a change in the first process variable F in the at least one working range KAB or at the working point KAP when process conditions change, and changing the at least one threshold value S0 to a second threshold value S0R according to the change of the first process variable F from a first value F0 to a second value F0R.

Abstract: A laser cutting method using a laser cutting machine includes a) cutting a workpiece using a laser cutting beam having a high power along a cutting line, b) scanning the cutting line on the workpiece using a laser scanning beam having a low power or using an illumination beam, and recording scanning data, c) changing at least one parameter of a plurality of parameters the laser cutting machine, repeating steps a) and b), and evaluating the scanning data with respect to the plurality of parameters of the laser cutting machine in a control device. The scanning of the cutting line on the workpiece using the laser scanning beam of the low power is carried out during a return travel of a laser machining head.

Abstract: A beam cutting method includes conducting at least one cutting procedure while capturing at least one quality parameter. The at least one cutting procedure is intermittently implemented with an operation not subject to a closed-loop control and intermittently implemented with an operation subject to the closed-loop control. The beam cutting method further includes defining a process window in a parameter space of at least one process parameter, and choosing the at least one process parameter within the process window during the operation not subject to the closed-loop control. The at least one process parameter is allowed to be outside of the process window during the operation subject to the closed-loop control. The beam cutting method further includes adapting the process window based on changes in the at least one process parameter during the operation subject to the closed-loop control and/or changes in the at least one quality parameter.

Abstract: A method for identifying disruptions during a machining process, more particularly during a cutting process, includes: machining, more particularly cutting, a workpiece while moving a machining tool, in particular a laser machining head, and the workpiece relative to one another, recording an image of a region on the workpiece to be monitored, the region to be monitored being an interaction region of the machining tool with the workpiece, and evaluating the image of the region to be monitored. For the purpose of identifying at least one disruption of the machining process, the presence or the lack of a local intensity drop in an intensity profile within the interaction region is detected, during the evaluation of the image, in an advancement direction of the machining process. There is also described an associated machining apparatus.

Abstract: A device for monitoring, in particular for closed-loop control, of a thermal cutting process carried out on a workpiece. The device includes a focusing unit for focusing a machining beam, in particular a laser beam, onto the workpiece for the formation of a kerf on the workpiece. The device also includes an image acquisition unit to generate at least one image of a region of the workpiece, and an evaluation unit configured to determine, based on the at least one image, at least one measured variable for the course of the gap width of the kerf in a thickness direction of the workpiece. The invention also relates to an associated method for monitoring, in particular for closed-loop control, of a thermal cutting process carried out on a workpiece.

Abstract: Described is laser machining nozzles for laser machining devices. The laser machining nozzles includes a body having an inner surface and an outer surface. The inner surface of the laser machining nozzles include at least one subarea. The subarea includes a layer of at least one of the copper oxides CuO and Cu2O. The layer of CuO and/or Cu2O has an absorbing effect for radiation at an observation wavelength between 300 and 1100 nm or between 900 and 1700 nm.

Abstract: The invention relates to devices and methods for monitoring or regulating a cutting process on a workpiece. A focusing element focuses a high-energy beam onto the workpiece. An image capture apparatus captures a region at the workpiece to be monitored. The region includes an interaction region of the high-energy beam with the workpiece. An control apparatus determines at least one characteristic variable of the cutting process, in particular of a kerf formed during the cutting process, on the basis of the captured interaction region.

Abstract: A method for monitoring, in particular for controlling, a cutting process on a workpiece, includes focusing a machining beam, in particular a laser beam, on the workpiece, detecting a region of the workpiece to be monitored, the region including an interaction region in which the machining beam interacts with the workpiece, and determining at least one characteristic variable of the cutting process, in particular of a kerf formed during the cutting process, on the basis of the detected interaction region. In a fusion cutting process, a cutting front length of a cutting front formed at the kerf is determined as a characteristic variable on the basis of the detected interaction region. A corresponding device for monitoring, in particular for controlling, a cutting process on a workpiece, is also provided.

Abstract: An example device for monitoring and controlling a laser cutting process on a workpiece includes an image capturing apparatus for capturing an image of a region of the workpiece to be monitored, in which the region of the workpiece to be monitored includes a region of interaction of a laser beam with the workpiece, and an evaluation apparatus for detecting material boundaries of the workpiece using the captured image. The evaluation apparatus is configured to determine at least one characteristic value of the laser cutting process based on a geometric relationship between at least two of the detected material boundaries, the region of interaction, or combinations thereof.

Abstract: The invention relates to devices and methods for monitoring or regulating a cutting process on a workpiece. A focusing element focuses a high-energy beam onto the workpiece. An image capture apparatus captures a region at the workpiece to be monitored. The region includes an interaction region of the high-energy beam with the workpiece. An control apparatus determines at least one characteristic variable of the cutting process, in particular of a kerf formed during the cutting process, on the basis of the captured interaction region.

Abstract: The invention relates to devices and methods for monitoring or regulating a cutting process on a workpiece. A focusing element focuses a high-energy beam onto the workpiece. An image capture apparatus captures a region at the workpiece to be monitored. The region includes an interaction region of the high-energy beam with the workpiece. An evaluation apparatus determines at least one characteristic variable of the cutting process, in particular of a kerf formed during the cutting process, on the basis of the captured interaction region.

Abstract: A device for monitoring, in particular for closed-loop control, of a thermal cutting process carried out on a workpiece. The device includes a focusing unit for focusing a machining beam, in particular a laser beam, onto the workpiece for the formation of a kerf on the workpiece. The device also includes an image acquisition unit to generate at least one image of a region of the workpiece, and an evaluation unit configured to determine, based on the at least one image, at least one measured variable for the course of the gap width of the kerf in a thickness direction of the workpiece. The invention also relates to an associated method for monitoring, in particular for closed-loop control, of a thermal cutting process carried out on a workpiece.

Abstract: The invention relates to a method for determining a focal position of a machining beam, in particular a laser beam, relative to a workpiece when machining the workpiece using the machining beam, having the following steps: receiving at least one spatially resolved image of a workpiece region to be monitored, said region comprising the cut edges of a cut gap formed during the machining process on the upper face of the workpiece, ascertaining a gap width of the cut gap on the upper face of the workpiece using the cut edges in the at least one spatially resolved image, and determining the focal position of the machining beam relative to the workpiece using the ascertained gap width. The invention also relates to a corresponding device.

Abstract: Described is laser machining nozzles for laser machining devices. The laser machining nozzles includes a body having an inner surface and an outer surface. The inner surface of the laser machining nozzles include at least one subarea. The subarea includes a layer of at least one of the copper oxides CuO and Cu2O. The layer of CuO and/or Cu2O has an absorbing effect for radiation at an observation wavelength between 300 and 1100 nm or between 900 and 1700 nm.

Abstract: The present disclosure relates to a device for monitoring and for controlling a laser cutting process on a workpiece, and a method of using the same. The device includes an image capturing apparatus for capturing an image of a region of the workpiece to be monitored, in which the region of the workpiece to be monitored includes a region of interaction of a laser beam with the workpiece, and an evaluation apparatus for detecting material boundaries of the workpiece using the captured image. The evaluation apparatus is configured to determine at least one characteristic value of the laser cutting process based on a geometric relationship between at least two of the detected material boundaries, the region of interaction, or combinations thereof.

Abstract: This disclosure relates to methods and apparatuses for determining a material type and/or a surface condition of a workpiece. A surface of the workpiece is illuminated with illuminating radiation. At least one image of the illuminated surface is recorded. The material type and/or the surface condition of the workpiece is determined on the basis of a statistical analysis of the at least one image converted into a spatial frequency domain.

Abstract: The present disclosure relates to a device for monitoring and for controlling a laser cutting process on a workpiece, and a method of using the same. The device includes an image capturing apparatus for capturing an image of a region of the workpiece to be monitored, in which the region of the workpiece to be monitored includes a region of interaction of a laser beam with the workpiece, and an evaluation apparatus for detecting material boundaries of the workpiece using the captured image. The evaluation apparatus is configured to determine at least one characteristic value of the laser cutting process based on a geometric relationship between at least two of the detected material boundaries, the region of interaction, or combinations thereof.

Abstract: The present disclosure relates to a device for monitoring and for controlling a laser cutting process on a workpiece, and a method of using the same. The device includes an image capturing apparatus for capturing an image of a region of the workpiece to be monitored, in which the region of the workpiece to be monitored includes a region of interaction of a laser beam with the workpiece, and an evaluation apparatus for detecting material boundaries of the workpiece using the captured image. The evaluation apparatus is configured to determine at least one characteristic value of the laser cutting process based on a geometric relationship between at least two of the detected material boundaries, the region of interaction, or combinations thereof.

Abstract: This disclosure relates to methods and apparatuses for determining a material type and/or a surface condition of a workpiece. A surface of the workpiece is illuminated with illuminating radiation. At least one image of the illuminated surface is recorded. The material type and/or the surface condition of the workpiece is determined on the basis of a statistical analysis of the at least one image converted into a spatial frequency domain.

Abstract: Methods, devices and systems for detecting an incomplete cutting action when cutting a workpiece with a high-energy beam are disclosed. In one aspect, a method includes taking an image of a region of the workpiece to be monitored, the region including an interaction region of the high-energy beam with the workpiece, evaluating the image taken in order to detect pooled slag at an end of the interaction region opposite a cutting front, and detecting whether a related cutting action is incomplete based on an occurrence of detection of pooled slag.