Patents by Inventor David Schlenke

David Schlenke has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20060082259
    Abstract: An apparatus and method for producing a substantially uniform bond line thickness by utilizing a crosshatch, grid pattern, or spacers of like patterns in a receptacle of a transducer housing. Certain embodiments include a housing configured to retain a transducer. The housing includes an annular wall and a receptacle adjacent to the wall. The receptacle has a member configured to allow radiation to pass through it. The member has a first surface and a second surface. The spacers on the first surface are configured in a grid pattern to maintain uniform spacing and a uniform bond line thickness between the transducer and the member. The bond line is further controlled by the depth of the spacers, which are configured to maintain a generally constant bond line thickness.
    Type: Application
    Filed: October 18, 2004
    Publication date: April 20, 2006
    Applicant: SSI Technologies, Inc.
    Inventor: David Schlenke