Patents by Inventor David Scott Duvall

David Scott Duvall has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Composite interlayer for diffusion bonding
    Patent number: 4038041
    Abstract: An interlayer for transient liquid phase diffusion bonding of the nickel, cobalt and iron alloys is provided between surfaces to be joined as a thin lamellar composite.
    Type: Grant
    Filed: December 19, 1975
    Date of Patent: July 26, 1977
    Assignee: United Technologies Corporation
    Inventors: David Scott Duvall, Daniel Francis Paulonis
  • Interlayer for transient liquid phase diffusion bonding
    Patent number: 4005988
    Abstract: A reduced melting point interlayer for transient liquid phase diffusion bonding of the nickel, cobalt and iron alloys is provided as a thin coating integral with one or more of the surfaces to be joined.
    Type: Grant
    Filed: December 19, 1975
    Date of Patent: February 1, 1977
    Assignee: United Technologies Corporation
    Inventors: Daniel Francis Paulonis, David Scott Duvall, Gerard Casimer Sikorowicz