Patents by Inventor David SELICKE

David SELICKE has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10488595
    Abstract: A photonic component that includes a photonically integrated chip and a fiber holder that is mechanically connected to said chip. The fiber holder includes at least one groove with an optical fiber laid therein. The chip includes a substrate whose substrate base material is a semiconductor material, an integrated optical waveguide that is integrated into one or more material layers of the chip, which layers are wave guiding and positioned on the substrate, a coupler formed in the optical waveguide or connected to said optical waveguide, particularly a grating coupler, and an optical diffraction and refraction structure that is integrated into one or more material layers of the chip which are positioned above the optical coupler when viewed from the substrate, and that shapes the beam prior to its being coupled into the waveguide or after being coupled out of the waveguide.
    Type: Grant
    Filed: July 28, 2017
    Date of Patent: November 26, 2019
    Assignee: Sicoya GmbH
    Inventors: Moritz Grehn, Sven Otte, Christoph Theiss, Stefan Meister, David Selicke, Hanjo Rhee
  • Publication number: 20190179082
    Abstract: The invention relates, inter alia, to a photonic component (1) that comprises a phonetically integrated chip (100) and a fibre holder (200) that is mechanically connected to said chip, said fibre holder comprising: at least one groove (210) with an optical fibre (220) laid therein, and at least one mirroring surface (230) which reflects the beam (S) of the fibre in the direction of the chip, and/or the beam of the chip in the direction of the fibre.
    Type: Application
    Filed: July 28, 2017
    Publication date: June 13, 2019
    Applicant: Sicoya GmbH
    Inventors: Moritz GREHN, Sven OTTE, Christoph THEISS, Stefan MEISTER, David SELICKE, Hanjo RHEE
  • Publication number: 20170242191
    Abstract: The invention relates, inter alia, to a photonically integrated chip (2) having a substrate (20), a plurality of material layers arranged on a top side (21) of the substrate (20), an optical waveguide which is integrated in one or more wave-guiding material layers of the chip (2), and a grating coupler (60) which is formed in the optical waveguide and causes beam deflection of radiation guided in the waveguide in the direction out of the layer plane of the wave-guiding material layer(s) or causes beam deflection of radiation to be coupled into the waveguide in the direction into the layer plane of the wave-guiding material layer(s).
    Type: Application
    Filed: September 25, 2015
    Publication date: August 24, 2017
    Applicants: Technische Universit├Ąt Berlin, Sicoya GmbH
    Inventors: Hanjo RHEE, Marvin HENNIGES, Stefan MERSTER, Christoph THEISS, David SELICKE, David STOLAREK, Lars ZIMMERMANN, Harald H. RICHTER