Patents by Inventor David Seung-Kyu Lee

David Seung-Kyu Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for bonding steel to copper
    Patent number: 5642853
    Abstract: A method is used to bond dissimilar metals, such as for an x-ray tube. Copper and steel tubular components are provided. An interlayer material situated between the metal layers is used to bond the copper and steel tubular components by solid state diffusion process. The interlayer material may be pure nickel, pure copper, or a layered combination of nickel and copper or copper alloy. The use of the low cost interlayer material and the solid state diffusion process yields a strong bond between the dissimilar metals.
    Type: Grant
    Filed: August 30, 1995
    Date of Patent: July 1, 1997
    Assignee: General Electric Company
    Inventor: David Seung-Kyu Lee