Patents by Inventor David Siegfried

David Siegfried has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20260098580
    Abstract: A seal assembly includes a first retainer and a second retainer. The first retainer includes a first base having a first inner surface defining a first aperture and a protrusion extending from the first inner surface. The second retainer is configured for removable connection with the first retainer and includes a second base having an outer surface, a second inner surface opposite the outer surface, and an end surface extending between the outer surface and the second inner surface. The second inner surface defines a second aperture. The end surface defines an opening configured to receive the protrusion. The outer surface defines a groove in communication with the opening and configured to translatably-receive the protrusion upon rotation of the second retainer relative to the first retainer.
    Type: Application
    Filed: October 4, 2024
    Publication date: April 9, 2026
    Inventors: David R. Peterson, Ryan Lewis, David Siegfried, Jared Bilas, Joseph Sudik, JR.
  • Publication number: 20260066594
    Abstract: A wiring assembly is configured to be coupled to a substrate. The wiring assembly includes a wire, a first connector, a wire clip, a connector clip, and a second connector. The wire is configured to be disposed within a channel of the substrate. The first connector is coupled to the wire. The wire clip is coupled to the wire and is configured to be disposed within the channel. The connector clip is coupled to the first connector and is configured to be coupled to an end of the substrate. The second connector is configured to be coupled to the substrate and includes a first cover and a second cover coupled to the first cover. The first and second covers define a cavity configured to receive the wire.
    Type: Application
    Filed: October 16, 2024
    Publication date: March 5, 2026
    Inventors: Shawn Chernushin, Joseph Sudik, JR., David R. Peterson, David Siegfried
  • Patent number: 12413062
    Abstract: A mounting device configured to attach an elongated article to a substrate includes a base portion and an attachment portion extending from the base portion. The attachment portion is configured to be received within an opening in the substrate and has a plurality of branches extending therefrom. The mounting device also includes a cap portion that is spaced apart from the base portion and defining an aperture in which the attachment portion is received. The plurality of branches engage the aperture and are configured to inhibit removal of the attachment portion from the aperture. The mounting device further includes a plurality of legs extending between the base portion and the cap portion that is configured to retain the elongated article between the base portion and the cap portion. A method of attaching an elongated article to a substrate using such a mounting device is also described.
    Type: Grant
    Filed: August 23, 2023
    Date of Patent: September 9, 2025
    Assignee: APTIV TECHNOLOGIES AG
    Inventors: David R. Peterson, Joseph Sudik, Jr., David Siegfried
  • Patent number: 12340924
    Abstract: A wiring assembly including a flex circuit including a plastic laminate layer and a mount location configured to receive a fastener secured to a substrate. The wiring assembly further includes a flex circuit attachment feature, the flex circuit attachment feature including an extruded material bonded to the plastic laminate layer at the mount location.
    Type: Grant
    Filed: November 29, 2022
    Date of Patent: June 24, 2025
    Assignee: Aptiv Technologies AG
    Inventors: David R. Peterson, Joseph Sudik, Jr., Jesse Braun, David Siegfried
  • Publication number: 20250157689
    Abstract: A method is disclosed for interconnecting electrical conductors using a grid pattern formed from an electrically conductive material on a dielectric substrate. The grid pattern includes regularly spaced apertures forming an interconnected grid array of conductive traces. By severing connections between a separate conductive trace and the rest of the grid array, individual conductive traces are created. A first conductor from a first electrical cable is attached to a first contact pad defined by one of the separate conductive traces, and a second conductor from a second electrical cable is attached to a second contact pad defined by another separate conductive trace. This arrangement enables the interconnection of the first conductor to the second conductor via the separate conductive trace.
    Type: Application
    Filed: September 27, 2024
    Publication date: May 15, 2025
    Inventors: David SIEGFRIED, Joseph Sudik, JR., David R. Peterson
  • Publication number: 20250070540
    Abstract: A mounting device configured to attach an elongated article to a substrate includes a base portion and an attachment portion extending from the base portion. The attachment portion is configured to be received within an opening in the substrate and has a plurality of branches extending therefrom. The mounting device also includes a cap portion that is spaced apart from the base portion and defining an aperture in which the attachment portion is received. The plurality of branches engage the aperture and are configured to inhibit removal of the attachment portion from the aperture. The mounting device further includes a plurality of legs extending between the base portion and the cap portion that is configured to retain the elongated article between the base portion and the cap portion. A method of attaching an elongated article to a substrate using such a mounting device is also described.
    Type: Application
    Filed: August 23, 2023
    Publication date: February 27, 2025
    Inventors: David R. Peterson, Joseph SUDIK, JR., David SIEGFRIED
  • Patent number: 12198835
    Abstract: A method of forming a flexible circuit, including providing a flexible flat cable with a first surface and a second surface. The first surface of the flexible flat cable is diametrically opposed to the second surface. A dispensing apparatus including a nozzle is further provided, and an extruded material is dispensed through the nozzle onto the first surface of the flexible flat cable. The extruded material is shaped into a pattern and cured onto the first surface of the flexible flat cable.
    Type: Grant
    Filed: November 29, 2022
    Date of Patent: January 14, 2025
    Assignee: Aptiv Technologies AG
    Inventors: David R. Peterson, Joseph Sudik, Jr., Jesse Braun, David Siegfried
  • Publication number: 20230187101
    Abstract: A method of forming a flexible circuit, including providing a flexible flat cable with a first surface and a second surface. The first surface of the flexible flat cable is diametrically opposed to the second surface. A dispensing apparatus including a nozzle is further provided, and an extruded material is dispensed through the nozzle onto the first surface of the flexible flat cable. The extruded material is shaped into a pattern and cured onto the first surface of the flexible flat cable.
    Type: Application
    Filed: November 29, 2022
    Publication date: June 15, 2023
    Inventors: David R. Peterson, Joseph Sudik, JR., Jesse Braun, David Siegfried
  • Publication number: 20230178264
    Abstract: A wiring assembly including a flex circuit including a plastic laminate layer and a mount location configured to receive a fastener secured to a substrate. The wiring assembly further includes a flex circuit attachment feature, the flex circuit attachment feature including an extruded material bonded to the plastic laminate layer at the mount location. The flex circuit attachment feature provides a structural strength at the mount location and provides a cushion between the flex circuit and the substrate.
    Type: Application
    Filed: November 29, 2022
    Publication date: June 8, 2023
    Inventors: David R. Peterson, Joseph Sudik, JR., Jesse Braun, David Siegfried
  • Patent number: 11497905
    Abstract: A controller implantable within the body of a patient as part of a left ventricular assist device (LVAD) system and a method therefore are provided. According to one aspect, the controller includes processing circuitry configured to receive inputs from at least one of: at least one internal component of the LVAD system, at least one external component of the LVAD system, and at least one clinician's device, and determine a charging rate for charging a battery of the LVAD system internal to the patient based on at least one of the received inputs.
    Type: Grant
    Filed: May 13, 2020
    Date of Patent: November 15, 2022
    Assignee: Medtronic, Inc.
    Inventors: Eric A. Schilling, Erin N. Reisfeld, Thomas W. Radtke, Brian D. Kuhnley, David Siegfried
  • Publication number: 20210353838
    Abstract: A controller implantable within the body of a patient as part of a left ventricular assist device (LVAD) system and a method therefore are provided. According to one aspect, the controller includes processing circuitry configured to receive inputs from at least one of: at least one internal component of the LVAD system, at least one external component of the LVAD system, and at least one clinician's device, and determine a charging rate for charging a battery of the LVAD system internal to the patient based on at least one of the received inputs.
    Type: Application
    Filed: May 13, 2020
    Publication date: November 18, 2021
    Inventors: Eric A. Schilling, Erin N. Reisfeld, Thomas W. Radtke, Brian D. Kuhnley, David Siegfried
  • Publication number: 20070155886
    Abstract: The present invention relates to substrates and coating compositions disposed thereon containing improved ultraviolet degradation resistance. Specifically, these coating compositions can contain multiple UV protectants and can advantageously be used in transparent, semi-transparent, and/or translucent coatings on substrates, particularly opaque or semi-opaque substrates such as wood, e.g., in order to inhibit, to reduce, and/or to minimize UV degradation of said substrates.
    Type: Application
    Filed: December 30, 2005
    Publication date: July 5, 2007
    Inventors: Robert Sheerin, Navin Tilara, Hrire Gharapetian, David Siegfried
  • Patent number: 6143461
    Abstract: The present invention relates to a method for negative a positive image, using a negative acting color proofing element comprising, sequentially, a strippable cover sheet; a crosslinked layer containing a polymer having phenolic groups; a color layer, containing a colorant, a polymeric binder, a polymerizable monomer and, optionally, a photoinitiator; a photoadhering layer containing polymerizable groups, and, optionally, a free radical photoinitiator; and a optional thermoplastic adhesive layer. At least one of the color layer and the photoadhering layer containing the photoinitiator. The element is first exposed to actinic radiation and then laminated to a receiver sheet. The composite peeled apart to thereby form a colored negative image on the receiver sheet.
    Type: Grant
    Filed: September 15, 1999
    Date of Patent: November 7, 2000
    Assignee: Agfa Corporation
    Inventors: Shane Hsieh, Rusty Koenigkramer, David Siegfried, Richard Shadrach, Wojciech Wilczak, Richard Zagroba
  • Patent number: 5738970
    Abstract: A negative-acting color proofing element comprising, sequentially, (i) a strippable, transparent cover sheet; (ii) a crosslinked layer, which comprises a polymer having phenolic groups; (iii) a color layer, which comprises an organic binder, a polymerizable monomer, a colorant, and an optional photoinitiator, (iv) a photoadhering layer, which comprises a polymerizable component having at least one ethylenically unsaturated group; a polymer comprising polyvinyl acetal and polyvinyl alcohol segments, having from about 1 to about 40 weight % polyvinyl alcohol content; and an optional photoinitiator, wherein least one of either the color layer or the photoadhering layer contains a photoinitiator; (v) a thermoplastic adhesive layer; and (vii) a receiver sheet. Preferably the polymerizable component and photoinitiator diffuse into the color layer during assembly of the element.
    Type: Grant
    Filed: March 24, 1997
    Date of Patent: April 14, 1998
    Assignee: Bayer Corporation
    Inventors: Shane Hsieh, Rusty Koenigkramer, Shuchen Liu, Richard Shadrach, David Siegfried, Wojciech Wilczak