Patents by Inventor David Smeets

David Smeets has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6873170
    Abstract: The invention relates to a device and a method for detecting the reliability of integrated semiconductor components. The device includes a carrier substrate for receiving an integrated semiconductor component that will be examined, a heating element, and a temperature sensor. The temperature sensor has at least a portion of a parasitic functional element of the semiconductor component. As a result, reliability tests can be carried out in a particularly accurate and space-saving manner.
    Type: Grant
    Filed: January 2, 2004
    Date of Patent: March 29, 2005
    Assignee: Infineon Technologies AG
    Inventors: Wilhelm Asam, Josef Fazekas, Andreas Martin, David Smeets, Jochen Von Hagen
  • Patent number: 6787799
    Abstract: The invention relates to a device and a method for detecting the reliability of integrated semiconductor components. The device includes a carrier substrate for receiving an integrated semiconductor component that will be examined, a heating element, and a temperature sensor. The temperature sensor has at least a portion of a parasitic functional element of the semiconductor component. As a result, reliability tests can be carried out in a particularly accurate and space-saving manner.
    Type: Grant
    Filed: July 23, 2002
    Date of Patent: September 7, 2004
    Assignee: Infineon Technologies AG
    Inventors: Wilhelm Asam, Josef Fazekas, Andreas Martin, David Smeets, Jochen Von Hagen
  • Publication number: 20040140826
    Abstract: The invention relates to a device and a method for detecting the reliability of integrated semiconductor components. The device includes a carrier substrate for receiving an integrated semiconductor component that will be examined, a heating element, and a temperature sensor. The temperature sensor has at least a portion of a parasitic functional element of the semiconductor component. As a result, reliability tests can be carried out in a particularly accurate and space-saving manner.
    Type: Application
    Filed: January 2, 2004
    Publication date: July 22, 2004
    Applicant: Infineon Technologies AG
    Inventors: Wilhelm Asam, Josef Fazekas, Andreas Martin, David Smeets, Jochen Von Hagen
  • Publication number: 20030020131
    Abstract: The invention relates to a device and a method for detecting the reliability of integrated semiconductor components. The device includes a carrier substrate for receiving an integrated semiconductor component that will be examined, a heating element, and a temperature sensor. The temperature sensor has at least a portion of a parasitic functional element of the semiconductor component. As a result, reliability tests can be carried out in a particularly accurate and space-saving manner.
    Type: Application
    Filed: July 23, 2002
    Publication date: January 30, 2003
    Inventors: Wilhelm Asam, Josef Fazekas, Andreas Martin, David Smeets, Jochen Von Hagen