Patents by Inventor David Soza

David Soza has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6191032
    Abstract: It has been observed that Si introduced into an Al metal line of an Al, Ti, and Si-containing layer stack of an integrated circuit, at concentrations uniformly less than the solid solubility of Si in Al, results in a reduction in Al metal line voiding. Such voiding is a stress induced phenomenon and the introduction of Si appears to reduce stresses in the Al metal lines. By controlling Ti deposition conditions to achieve desired thickness and grain-size characteristics of the Ti underlayer, a self-regulating filter for introduction of Si into the Al metal layer is provided. Si is introduced into the Al metal layer by migration through a suitably deposited Ti layer, rather than during Al layer deposition.
    Type: Grant
    Filed: February 4, 1997
    Date of Patent: February 20, 2001
    Assignee: Advanced Micro Devices, Inc.
    Inventors: Don A. Tiffin, William S. Brennan, David Soza, Patrick L. Smith, Allen White, Tim Z. Hossain