Patents by Inventor David Stagg

David Stagg has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6160517
    Abstract: A printed circuit board assembly testing device includes a LISN device connected to a power source and to a test enclosure. The test enclosure includes a power supply and a communication port. A signal analyzer is interfaced to the LISN device. A circuit board assembly unit under test is positioned in the test enclosure. A controlling computer is interfaced to the communication port. The controlling computer includes a hard disk storage device having benchmark data stored therein. A communication bus interconnects the controlling computer to the signal analyzer. The unit under test is powered up and emissions data is observed which correlates to activity in the unit under test. The emissions data is compared to the benchmark data and a determination can be made as to whether the observed data meets the benchmark data within an acceptable tolerance.
    Type: Grant
    Filed: January 20, 1998
    Date of Patent: December 12, 2000
    Assignee: Dell USA, LLP
    Inventors: James S. Bell, David Staggs
  • Patent number: 5451720
    Abstract: A circuit board having a thermal relief pattern for isolating heat generated during soldering of components thereon. The circuit board comprises (1) a substantially planar insulating substrate, the substrate having a via therethrough and (2) a substantially planar conductive layer located over the substrate, the via passing through the layer, the layer having a thermal relief pattern comprising a plurality of apertures located about the via, the plurality of apertures cooperating to restrict heat flow across the thermal relief pattern, each of the plurality of apertures having a boundary with the conductive layer free of discontinuities to inhibit edge effect electromagnetic resonance, the plurality of apertures defining a plurality of corresponding conductive bands in the conductive layer and between the plurality of apertures, the conductive bands cooperating to provide a predetermined minimum level of electrical conduction across the thermal relief pattern.
    Type: Grant
    Filed: March 23, 1994
    Date of Patent: September 19, 1995
    Assignee: Dell USA, L.P.
    Inventors: H. Scott Estes, David Staggs, Deepak Swamy
  • Patent number: 5448138
    Abstract: A light that meets Federal Aviation Administration requirements for marking powerlines or powerline support structures that is powered from the magnetic field created by the conduction of electricity along a powerline. The energy in the naturally occurring magnetic filed induces an electric current in a specialized coil within the device that delivers a constant voltage to a lamp. The lamp is focused through a lens into the beam pattern required for marking powerline support structures.
    Type: Grant
    Filed: December 22, 1992
    Date of Patent: September 5, 1995
    Inventor: David Staggs