Patents by Inventor David Staintes

David Staintes has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of forming a stacked device filler
    Patent number: 7320928
    Abstract: Numerous embodiments of a stacked device filler and a method of formation are disclosed. In one embodiment, a method of forming a stacked device filler comprises forming a material layer between two or more substrates of a stacked device, and causing a reaction in at least a portion of the material, wherein the reaction may comprise polymerization, and the material layer may be one or a combination of materials, such as nonconductive polymer materials, for example.
    Type: Grant
    Filed: June 20, 2003
    Date of Patent: January 22, 2008
    Assignee: Intel Corporation
    Inventors: Grant M. Kloster, David Staintes, Shriram Ramanathan
  • Method of forming a stacked device filler
    Patent number: 6984873
    Abstract: Numerous embodiments of a stacked device filler and a method of formation are disclosed. In one embodiment, a method of forming a stacked device filler comprises forming a material layer between two or more substrates of a stacked device, and causing a reaction in at least a portion of the material, wherein the reaction may comprise polymerization, and the material layer may be one or a combination of materials, such as nonconductive polymer materials, for example.
    Type: Grant
    Filed: December 5, 2003
    Date of Patent: January 10, 2006
    Assignee: Intel Corporation
    Inventors: Grant M. Kloster, David Staintes, Shriram Ramanathan
  • Method of forming a stacked device filler
    Publication number: 20040256736
    Abstract: Numerous embodiments of a stacked device filler and a method of formation are disclosed. In one embodiment, a method of forming a stacked device filler comprises forming a material layer between two or more substrates of a stacked device, and causing a reaction in at least a portion of the material, wherein the reaction may comprise polymerization, and the material layer may be one or a combination of materials, such as nonconductive polymer materials, for example.
    Type: Application
    Filed: June 20, 2003
    Publication date: December 23, 2004
    Inventors: Grant M. Kloster, David Staintes, Shriram Ramanathan
  • Method of forming a stacked device filler
    Publication number: 20040256724
    Abstract: Numerous embodiments of a stacked device filler and a method of formation are disclosed. In one embodiment, a method of forming a stacked device filler comprises forming a material layer between two or more substrates of a stacked device, and causing a reaction in at least a portion of the material, wherein the reaction may comprise polymerization, and the material layer may be one or a combination of materials, such as nonconductive polymer materials, for example.
    Type: Application
    Filed: December 5, 2003
    Publication date: December 23, 2004
    Inventors: Grant M. Kloster, David Staintes, Shriram Ramanathan