Patents by Inventor David Stalling

David Stalling has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11716836
    Abstract: A chassis-mounted electronic device includes a conductive chassis, an upper EMI gasket, and a lower EMI gasket. An upper chassis and a lower chassis of the conductive chassis are coupled to form an interior of the chassis housing an electronic device. The upper EMI gasket is attached to the upper chassis, and resiliently contacts a portion of the electronic device. The lower EMI gasket is attached to the lower chassis, and resiliently contacts a different portion of the electronic device. The upper and lower EMI gaskets include perforations to allow cooling air through the EMI gaskets and into the interior of the chassis. The conductive chassis, the upper EMI gasket, and the lower EMI gasket provide EMI shielding for the electronic device.
    Type: Grant
    Filed: July 7, 2021
    Date of Patent: August 1, 2023
    Assignee: CISCO TECHNOLOGY, INC.
    Inventors: Vic Hong Chia, George Edward Curtis, John David Stallings
  • Publication number: 20220270015
    Abstract: Systems and methods for agricultural assistance are provided. An agricultural assistance system may measure spectral data for crops, determine crop information including a first crop type based on the spectral data, receive supplementary data, and recommend a second crop type based on the crop information and supplementary data. The agricultural assistance system may also provide crop information to a user based on the spectral data and the supplementary data.
    Type: Application
    Filed: February 22, 2021
    Publication date: August 25, 2022
    Inventors: David M. Vanderpool, David Stallings Vanderpool
  • Publication number: 20210337707
    Abstract: A chassis-mounted electronic device includes a conductive chassis, an upper EMI gasket, and a lower EMI gasket. An upper chassis and a lower chassis of the conductive chassis are coupled to form an interior of the chassis housing an electronic device. The upper EMI gasket is attached to the upper chassis, and resiliently contacts a portion of the electronic device. The lower EMI gasket is attached to the lower chassis, and resiliently contacts a different portion of the electronic device. The upper and lower EMI gaskets include perforations to allow cooling air through the EMI gaskets and into the interior of the chassis. The conductive chassis, the upper EMI gasket, and the lower EMI gasket provide EMI shielding for the electronic device.
    Type: Application
    Filed: July 7, 2021
    Publication date: October 28, 2021
    Inventors: Vic Hong Chia, George Edward Curtis, John David Stallings
  • Publication number: 20210298211
    Abstract: A chassis-mounted electronic device includes a chassis, an upper EMI gasket, and a lower EMI gasket is provided. The chassis, including an upper chassis and a lower chassis, is constructed from a conductive sheet with a first thickness. The upper chassis and the lower chassis are coupled to form an interior of the chassis housing an electronic device. The upper EMI gasket is attached to the upper chassis, and is thinner than the upper chassis. The lower EMI gasket is attached to the lower chassis, and is also thinner than the lower chassis. The upper and lower EMI gaskets include perforations to allow cooling air through the EMI gaskets and into the interior of the chassis. Both the upper EMI gasket and the lower EMI gasket are configured to resiliently contact a portion of the electronic device to provide EMI shielding for the electronic device.
    Type: Application
    Filed: March 23, 2020
    Publication date: September 23, 2021
    Inventors: Vic Hong Chia, George Edward Curtis, John David Stallings
  • Patent number: 11129311
    Abstract: A chassis-mounted electronic device includes a chassis, an upper EMI gasket, and a lower EMI gasket is provided. The chassis, including an upper chassis and a lower chassis, is constructed from a conductive sheet with a first thickness. The upper chassis and the lower chassis are coupled to form an interior of the chassis housing an electronic device. The upper EMI gasket is attached to the upper chassis, and is thinner than the upper chassis. The lower EMI gasket is attached to the lower chassis, and is also thinner than the lower chassis. The upper and lower EMI gaskets include perforations to allow cooling air through the EMI gaskets and into the interior of the chassis. Both the upper EMI gasket and the lower EMI gasket are configured to resiliently contact a portion of the electronic device to provide EMI shielding for the electronic device.
    Type: Grant
    Filed: March 23, 2020
    Date of Patent: September 21, 2021
    Assignee: CISCO TECHNOLOGY, INC.
    Inventors: Vic Hong Chia, George Edward Curtis, John David Stallings
  • Publication number: 20210093972
    Abstract: A method comprises sending to a computer processor a log-in identifier to access a virtual garage stored in an online database. The virtual garage can contain computer code representing at least one vehicle stored in the virtual garage, and the vehicle being comprised of a plurality of components. Instructions can be sent to the computer processor from the first party to display the at least one vehicle in the virtual garage. A replacement component for at least one of the plurality of components is selected and sent by the first party to the computer processor, along with instructions to replace the component with the replacement component to create a new vehicle. Once the new vehicle is created, it can be displayed on the end user device.
    Type: Application
    Filed: September 26, 2019
    Publication date: April 1, 2021
    Applicant: Thoughtfull Toys, Inc.
    Inventors: David Eugene Silverglate, Cyril Brian Gulassa, Yusheng Deng, Jonathan David Stallings
  • Publication number: 20080085507
    Abstract: A device is described which provides an automated or manual means to perform chromatographic affinity-based A1c analyses of whole blood or hemolysates in less than 1 minute. Further, such applications are useful for the quantitation of glycated plasma proteins used in analysis of gestational diabetes. The device includes several modules integrated to accomplish processing and analysis of the blood sample. One such module includes a disposable liquid chromatographic column which may be rapidly packed and is easily assembled from readily available materials. Such columns and assemblies may be used in fluid chromatography applications requiring separations of complex materials for purposes of purification and/or quantitation of particular analytes. The columns may be used as stand-alone units or may be integrated into commercially available chromatography systems. The columns have a chemical composition and particle size that allow for low operational pressures.
    Type: Application
    Filed: October 5, 2007
    Publication date: April 10, 2008
    Applicant: Affinex, LLC
    Inventors: Thomas Stroud, David Stalling, Thomas Dobbs, Jeffrey Wiseman