Abstract: A co-planar differential pressure sensor module is provided. The module includes a base having a pair of recesses. A pair of pedestals is also provided where each pedestal is disposed in a respective recess and is coupled to a respective isolation diaphragm. A differential pressure sensor has a sensing diaphragm and a pair of pressure sensing ports. Each port of the differential pressure sensor is fluidically coupled to a respective isolation diaphragm by a fill fluid. The module also includes circuitry coupled to the differential pressure sensor to measure an electrical characteristic of the sensor that varies with differential pressure. The base is constructed from a material that is suitable for submersion in seawater. A method of constructing a co-planar differential pressure sensor module is also provided. In another embodiment, a pressure sensor module is provided. The pressure sensor module includes a base having a recess. A pedestal is disposed in the recess and is coupled to an isolation diaphragm.

Abstract: A large-scale MEMS device includes a MEMS die supported by at least one compliant die mount. The compliant die mount couples the MEMS die to a support structure. The support structure is positioned within a package. In accordance with an aspect of the invention, the package is substantially symmetrical about the MEMS die. In accordance with another aspect of the invention, the support structure and/or the package is designed to have a neutral bend axis along the MEMS die.

Abstract: A large-scale MEMS device includes a MEMS die supported by at least one compliant die mount. The compliant die mount couples the MEMS die to a support structure. The support structure is positioned within a package. In accordance with an aspect of the invention, the package is substantially symmetrical about the MEMS die. In accordance with another aspect of the invention, the support structure and/or the package is designed to have a neutral bend axis along the MEMS die.

Abstract: An electrical connector protects a pressure sensor stem that protrudes from a pressure sensor capsule. The electrical connector includes a baseplate with a central hole and a peripheral wall joined to the baseplate and protruding below the baseplate. The peripheral wall slidingly engages the pressure sensor capsule as the pressure sensor stem passes through the central hole to protrude above the baseplate. A protective wall joined to the baseplate protrudes above the pressure sensor stem and protects the pressure sensor stem. A lead frame in the protective wall provides electrical connections to sensor contact pads on the pressure sensor stem.

Abstract: A grip for holding soft materials is described wherein the gripping surface of the grip is cooled by a thermo-electric cooler. The grip of the present invention includes grip members having opposed gripping surfaces that contact the soft material. The grip does not require use of cryogenic materials and is suitable for use in contact with fluids at body temperature. The temperature of the grip can be easily controlled.