Patents by Inventor David Sturge

David Sturge has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6809436
    Abstract: An electromagnetic microactuator having a ferromagnetic substrate, preferably steel. A plurality of layers are deposited upon the substrate including an insulating layer, a seed layer and first and second photoresist layers. The first photoresist layer provides a coil well which defines the deposition location of a coil metal. The second photoresist layer provides central and peripheral core wells which define the deposition locations of a central core and a peripheral core, respectively. The second photoresist layer intersticially fills and protectively covers the coil.
    Type: Grant
    Filed: March 14, 2003
    Date of Patent: October 26, 2004
    Assignee: Delphi Technologies, Inc.
    Inventors: Shih-Chia Chang, Marie I. Harrington, David Sturge Eddy, Michael W. Putty, Jeffrey M Kempisty
  • Publication number: 20040189106
    Abstract: An electromagnetic microactuator having a ferromagnetic substrate, preferably steel. A plurality of layers are deposited upon the substrate including an insulating layer, a seed layer and first and second photoresist layers. The first photoresist layer provides a coil well which defines the deposition location of a coil metal. The second photoresist layer provides central and peripheral core wells which define the deposition locations of a central core and a peripheral core, respectively. The second photoresist layer intersticially fills and protectively covers the coil.
    Type: Application
    Filed: March 14, 2003
    Publication date: September 30, 2004
    Inventors: Shih-Chia Chang, Marie I. Harrington, David Sturge Eddy, Michael W. Putty, Jeffrey M. Kempisty
  • Patent number: 6746584
    Abstract: A wide range oxygen sensor comprising a first oxygen pump cell, the first pump cell comprising: a first and a second electrode, with a first communication zone therebetween, the first electrode being exposed to exhaust gas, the second electrode being exposed to a heat source; and wherein at least one element of said first pump cell incorporates a gas-diffusion limiting characteristic; a second oxygen pump cell, operating at opposite polarity from said first oxygen pump cell, electrically isolated from said first oxygen pump cell, and disposed within a sensor substrate, the second cell comprising: a third and a fourth electrode, with a second communication zone therebetween, the third electrode being exposed to exhaust gas, the fourth electrode being exposed to a heat source; and wherein at least one element of said second pump cell incorporates a gas-diffusion limiting characteristic; at least one heating element for providing heat to said second electrode and said fourth electrode; and an electrical circuit
    Type: Grant
    Filed: December 15, 1999
    Date of Patent: June 8, 2004
    Assignee: Delphi Technologies, Inc.
    Inventors: Da Yu Wang, Paul Casey Kikuchi, Lone-Wen F. Tai, David Sturge Eddy, Raymond Leo Bloink, Eric J. Detwiler, Larry Max Oberdier
  • Patent number: 6498726
    Abstract: The invention relates to the provision of a cooling effect on components (6) of electrical apparatus which are mounted on an upper surface (8) of a printed circuit board (4) within a housing (2). The invention provides for the mounting of a material layer (12) which can absorb or otherwise dissipate heat and the invention allows the mounting of the said material (12) beneath the printed circuit board (4) within the housing (2) in position to provide improved cooling effect without contacting the components (6) themselves.
    Type: Grant
    Filed: December 14, 2000
    Date of Patent: December 24, 2002
    Assignee: Pace Micro Technology Plc
    Inventors: Colin Fuller, Anthony Bristow, Stephen Cross, David Woodhouse, David Sturge
  • Publication number: 20010008481
    Abstract: The invention relates to the provision of a cooling effect on components (6) of electrical apparatus which are mounted on an upper surface (8) of a printed circuit board (4) within a housing (2). The invention provides for the mounting of a material layer (12) which can absorb or otherwise dissipate heat and the invention allows the mounting of the said material (12) beneath the printed circuit board (4) within the housing (2) in position to provide improved cooling effect without contacting the components (6) themselves.
    Type: Application
    Filed: December 14, 2000
    Publication date: July 19, 2001
    Applicant: Pace Micro Technology P1c
    Inventors: Colin Fuller, Anthony Bristow, Stephen Cross, David Woodhouse, David Sturge