Patents by Inventor David Stuwe

David Stuwe has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20110177651
    Abstract: A method for producing a metal structure on a surface of a semiconductor substrate, including the following steps: A applying a metal layer, B applying a structuring layer and C removing the structuring layer. Either step B is carried out after step A, and step C after step B in a masking method, so that the structuring layer covers the metal layer at least partially and, after step B is carried out, the metal layer is removed from the regions not covered by the structuring layer, before step C is carried out or, in a lift-off method, step A is carried out after step B, and step C after step A, so that the structuring layer is covered essentially by the metal layer and, at least in the regions, in which the metal layer covers the structuring layer, the metal layer is detached when step C is carried out. It is essential that the structuring layer in step B is produced by a hot melt ink.
    Type: Application
    Filed: June 19, 2009
    Publication date: July 21, 2011
    Applicant: Fraunhofer-Gesellschaft Zur Forderung Der Angewandten Forschung E.V.
    Inventors: Nicola Mingirulli, Daniel Biro, Christian Schmiga, Jan Specht, David Stuwe