Abstract: A fluid deflection device for use in a work piece holder during a semiconductor wafer grinding process is disclosed. The fluid deflection device includes an annular, upstanding splash fence, and an attachment portion associated with the splash fence and configured to attach to the work piece holder, thereby to hold the splash fence in a position to inhibit fluid from flowing between rotatable and non-rotatable parts of the work piece holder.

Abstract: A wafer edge grinding machine including a chuck rotatable about a first axis, a chuck basin having bottom and side walls surrounding the chuck and a fine aligner disposed over an open top of the basin and configured to deliver wafers to the chuck. The machine further includes a probe having a sensor contact surface and a shifting mechanism adapted to selectively withdraw the sensor contact surface to a storage position and extend the contact surface to a measurement position. The probe also includes a mounting structure adapted to secure the probe to one of the walls in the basin with the probe being mounted in the basis to position the contact surface adjacent the perimeter of a wafer disposed on the chuck. The shifting mechanism includes a remotely operable control adapted to allow a user to operate the shifting mechanism from a location remote from the basin.