Patents by Inventor David T. Beegan

David T. Beegan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 4806957
    Abstract: A new design for electrostatic printheads, and the like, which can be formed quickly, easily, inexpensively, and reliably employing wire bonding techniques. The preferred method disclosed is a method for simultaneously making two electrostatic printhead portions each having a row of dot-producing conducting printwire ends at a planar print face. A pair of printed circuit boards containing a plurality of parallel, spaced, flat, conductor strip ends along edges thereof are disposed in a common plane with the conductor strip ends positioned opposite one another in paris. Connecting wires are then wire bonded between the pairs of strip ends. The connecting wires are then embedded in an insulating material which will adhesively bond to the printed circuit boards along the edges thereof and cure into a hard material forming the body of the resultant printhead elements.
    Type: Grant
    Filed: March 21, 1988
    Date of Patent: February 21, 1989
    Assignee: Calcomp Inc.
    Inventor: David T. Beegan
  • Patent number: 4766448
    Abstract: Methods and apparatus for forming an electrostatic printhead. The basic printhead member if formed by casting an insulating material around a plurality of side-by-side spaced wires. One side of the insulating material and the wires are cut off to form a printhead face. The other side of the insulating material and the wires are cut off to form an attachment face with the wire ends exposed. A printed circuit board having electrical contacts along the edge is positioned adjacent the exposed wire ends of the attachment face and the wire ends are wire bonded to the contacts. In one embodiment, there are two printed circuit boards positioned on either side of the attachment face and then folded together following the wire bonding. In another embodiment, the attachment face is formed as ledges having the exposed ends of the wires cut as rectangular pads for more area of attachment and the insulating material is attached to the edge of a single printed circuit board.
    Type: Grant
    Filed: August 19, 1987
    Date of Patent: August 23, 1988
    Assignee: Sanders Associates, Inc.
    Inventors: James R. Hack, Bernard V. Masson, David T. Beegan