Patents by Inventor David T. Brown

David T. Brown has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240107113
    Abstract: Various implementations disclosed herein include devices, systems, and methods that provide video content (e.g., a TV show, a recorded sporting event, a movie, a 3D video, etc.) within a 3D environment using parameters selected based on one or more contextual factors. Such contextual factors may be determined based on an attribute of the content (e.g., its intended purpose or viewing environment), the user (e.g., the user's visual quality, interpupillary distance, etc.), the 3D environment (e.g., current lighting conditions, spatial considerations, etc.), or other context attributes.
    Type: Application
    Filed: September 15, 2023
    Publication date: March 28, 2024
    Inventors: Danvin Ruangchan, David M. Cole, Joshua J. Taylor, Christopher T. Eubank, Samir Gehani, Travis W. Brown, Shai Messingher Lang
  • Patent number: 10830656
    Abstract: A process of forming an overmolded lead frame assembly for a pressure sensing application includes clamping both sides of a lead frame to performing a primary overmolding operation to prevent resin flash on wire bonding areas on the lead frame. The process also includes performing the primary overmolding operation to form a primary mold that covers selected portions of the lead frame on first and second sides of the lead frame assembly. The primary mold forms an electronics cavity on the first side of the lead frame assembly to enable subsequent wire-bonding of a microelectromechanical system (MEMS) pressure sensing element to the wire bonding areas. The process further includes performing a secondary overmolding operation to form a secondary mold on the second side of the lead frame assembly. The secondary mold covers an exposed portion of the lead frame beneath the wire bonding areas.
    Type: Grant
    Filed: June 1, 2018
    Date of Patent: November 10, 2020
    Assignee: SENSATA TECHNOLOGIES, INC.
    Inventors: Jun H. Bae, David T. Brown, Andrew C. Herron
  • Publication number: 20190368958
    Abstract: A process of forming an overmolded lead frame assembly for a pressure sensing application includes clamping both sides of a lead frame to performing a primary overmolding operation to prevent resin flash on wire bonding areas on the lead frame. The process also includes performing the primary overmolding operation to form a primary mold that covers selected portions of the lead frame on first and second sides of the lead frame assembly. The primary mold forms an electronics cavity on the first side of the lead frame assembly to enable subsequent wire-bonding of a microelectromechanical system (MEMS) pressure sensing element to the wire bonding areas. The process further includes performing a secondary overmolding operation to form a secondary mold on the second side of the lead frame assembly. The secondary mold covers an exposed portion of the lead frame beneath the wire bonding areas.
    Type: Application
    Filed: June 1, 2018
    Publication date: December 5, 2019
    Inventors: JUN H. BAE, DAVID T. BROWN, ANDREW C. HERRON
  • Patent number: 5568663
    Abstract: A disposable rescue mattress comprised of a mattress being comprised of an upper sheet and a lower sheet. The upper sheet and lower sheet are secured together along peripheral edges thereof to form an upper edge, a lower edge, and two side edges. The lower edge has an air intake valve extending therethrough into the inner surface of the mattress. The device also includes a blanket having an upper edge, a lower edge, and two side edges. The lower edge and two side edges are secured to the corresponding lower edge and two side edges of the mattress with the upper edge extending upwardly beyond the upper edge of the mattress.
    Type: Grant
    Filed: July 14, 1995
    Date of Patent: October 29, 1996
    Inventor: David T. Brown
  • Patent number: 4476524
    Abstract: The embodiment provides an independent data bus path between a random access page storage (PS), and a main storage (MS), wherein this independent data bus does not pass through any channel processor (CH) or central processor (CP). Page data transfers on the independent data bus can be controlled either (1) asynchronously by a channel processor (independently of any central processor instruction stream), or (2) synchronously by a CP (independently of any CH operation). Novel CP instructions enable the CP to synchronously control the transfer of pages in either direction on the independent data bus.A channel program for controlling the page transfer may be initiated by a start I/O (SIO) or start subchannel (SSCH) instruction in the CPU, and it accesses a special field in a channel address word (CAW) that designates the use of the page storage. Novel PS channel command words (CCWs) in the channel program enable CH to control page transfers on the independent data bus.
    Type: Grant
    Filed: July 2, 1981
    Date of Patent: October 9, 1984
    Assignee: International Business Machines Corporation
    Inventors: David T. Brown, Don W. Rain, Richard J. Schmalz