Patents by Inventor David T. Naugle

David T. Naugle has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Injection molded solder ball method
    Patent number: 7955966
    Abstract: Methods for making solder balls, which can be used to bump semiconductor wafers are disclosed. Methods for bumping semiconductor wafers with the solder balls are also disclosed. The solder balls can be made using an injection molded soldering (IMS) process.
    Type: Grant
    Filed: August 19, 2009
    Date of Patent: June 7, 2011
    Assignee: International Business Machines Corporation
    Inventors: Peter A. Gruber, Barry A. Hochlowski, David T. Naugle
  • INJECTION MOLDED SOLDER BALL METHOD
    Publication number: 20090309219
    Abstract: Methods for making solder balls, which can be used to bump semiconductor wafers are disclosed. Methods for bumping semiconductor wafers with the solder balls are also disclosed. The solder balls can be made using an injection molded soldering (IMS) process.
    Type: Application
    Filed: August 19, 2009
    Publication date: December 17, 2009
    Applicant: IBM Corporation
    Inventors: Peter A. Gruber, Barry A. Hochlowski, David T. Naugle
  • INJECTION MOLDED SOLDER BALL METHOD
    Publication number: 20080164609
    Abstract: Methods for making solder balls, which can be used to bump semiconductor wafers are disclosed. Methods for bumping semiconductor wafers with the solder balls are also disclosed. The solder balls can be made using an injection molded soldering (IMS) process.
    Type: Application
    Filed: January 8, 2007
    Publication date: July 10, 2008
    Applicant: International Business Machines Corporation
    Inventors: Peter A. Gruber, Barry A. Hochlowski, David T. Naugle
  • Contact sensor-based microdispensing tool
    Patent number: 5507872
    Abstract: A contact-based microdispensing tool for delivering extremely minute globules of epoxy material to repaired sites on high circuit density modules. The tool includes a solid probe integrally mounted in a contact sensor assembly incorporating an air-levitated core of a linear voltage differential transducer. The levitated core and the probe connected thereto are supported in neutral equilibrium by an air bearing assembly. As the assembly probe is brought into contact with one of the sites, the globule flows upon the site, the equilibrium is disturbed and a signal is produced by the transducer to halt movement of the probe relative to the site.
    Type: Grant
    Filed: November 22, 1994
    Date of Patent: April 16, 1996
    Assignee: International Business Machines Corporation
    Inventors: Annette B. Antenucci, Michael Berger, Judy E. Lambert, David T. Naugle, Stephen A. Olson, Jae M. Park, Thomas Rednour, Benoit Ventimiglia, Richard J. Weckesser