Patents by Inventor David T. Swanson

David T. Swanson has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11960683
    Abstract: A display system for sensing a finger of a user applied to the display system includes a display panel; a sensor for sensing the finger; a sensing light source configured to emit a first light having a first wavelength W1; and a reflective polarizer disposed between the display panel and the sensor. For a substantially normally incident light, an optical transmittance of the reflective polarizer versus wavelength for a first polarization state has a band edge such that for a first wavelength range extending from a smaller wavelength L1 to a greater wavelength L2 and including W1, where 30 nm?L2?L1?50 nm and L1 is greater than and within about 20 nm of a wavelength L3 corresponding to an optical transmittance of about 50% along the band edge, the optical transmittance has an average of greater than about 75%.
    Type: Grant
    Filed: May 4, 2021
    Date of Patent: April 16, 2024
    Assignee: 3M INNOVATIVE PROPERTIES COMPANY
    Inventors: Bharat R. Acharya, Robert D. Taylor, Joseph P. Attard, Benjamin J. Forsythe, David T. Yust, Matthew E. Sousa, Jason S. Petaja, Anthony M. Renstrom, William Blake Kolb, Matthew S. Cole, Matthew S. Stay, Matthew R. D. Smith, Jeremy O. Swanson, Tri D. Pham, David A. Rosen, Qunyi Chen, Lisa A. DeNicola, Quinn D. Sanford, Carl A. Stover, Lin Zhao, Gilles J. Benoit
  • Patent number: 5189275
    Abstract: A method of applying discrete areas of a noble metal to individual pads on a flexible printed circuit board comprises the steps of forming a particular pattern of electrically conductive material on a flexible, electrically insulating substrate. The pattern includes individual pads. An aperture is formed through the electrically insulating substrate to expose a portion of the underside of at least one of the individual pads, and then contacting the underside with an electrode, contacting the upper surface of the individual pad with a wire comprised of the noble metal, applying a welding current between the electrode and the wire to weld the wire to the pad and severing the wire to leave a particular amount on the upper surface of the pad.
    Type: Grant
    Filed: August 21, 1989
    Date of Patent: February 23, 1993
    Assignee: GTE Products Corporation
    Inventors: Frank J. Avellino, Richard A. Case, David T. Swanson
  • Patent number: 5133510
    Abstract: A column such as a concrete bridge or overpass column is reinforced by transverse post tensioning a steel wire around the length of the column. Apparatus for winding the wire around the column includes a first support frame which is attached to the column and a second support frame which is movably positioned around the column. The second support frame is movably supported on the first support frame whereby the second support frame can move axially along the length of the column. The second support frame includes a fixed inner ring, and a rotatable outer ring engages the inner ring in a tongue-in-groove fashion. The outer ring supports a spool of wire and a tensioning spool, and a drive motor and pinion mounted to the fixed inner ring drives the outer ring gear and rotates the spool of wire around the column as the second support frame is translated axially along a length of the column. The first support frame is repeatedly moved along the column until the full length of the column has been wound with wire.
    Type: Grant
    Filed: May 14, 1990
    Date of Patent: July 28, 1992
    Assignee: VSL Corporation
    Inventors: Edgar A. Davis, David T. Swanson
  • Patent number: 4925522
    Abstract: A method of making printed circuit boards having gold dot contacts formed on the terminal pads is disclosed. A first layer of copper is overlayed with a pattern of tin or solder which acts as a resist. The gold dot contacts are resistance welded to the terminal pads. The copper underlayment and its pattern of tin or solder carrying the gold dots is then bonded to an electrically insulating substrate, which can be flexible, to form a composite board which is then etched to form a printed circuit board having gold dot contacts thereon. Other materials than tin or solder can be employed so long as there is a difference in etchability between it and the copper foil.
    Type: Grant
    Filed: August 21, 1989
    Date of Patent: May 15, 1990
    Assignee: GTE Products Corporation
    Inventors: Frank J. Avellino, Richard A. Case, David T. Swanson
  • Patent number: 4621943
    Abstract: Disclosed is a method and apparatus for forming continuous slabs having parallel longitudinally extending post-tensioned tendons therein.
    Type: Grant
    Filed: October 9, 1984
    Date of Patent: November 11, 1986
    Assignee: VSL Corporation
    Inventor: David T. Swanson