Patents by Inventor David Taiwai Chin

David Taiwai Chin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Leadless leadframe and semiconductor device package therefrom
    Patent number: 11855001
    Abstract: A semiconductor device package includes a leadless leadframe, and a plurality of terminal pads extending to a periphery of the leadframe. At least two of the plurality of terminal pads are interior extending terminal pads that include an interior portion having a shape including at least one curved portion and an exterior portion that extends to the periphery of the leadframe. An integrated circuit (IC) die having at least a semiconductor surface includes circuitry configured for at least one function having nodes connected to bond pads on the leadframe. There is a bonding arrangement between the plurality of terminal pads and the bond pads. A mold compound is for encapsulation of the semiconductor device package.
    Type: Grant
    Filed: November 4, 2020
    Date of Patent: December 26, 2023
    Assignee: Texas Instruments Incorporated
    Inventors: Mohammad Waseem Hussain, David Taiwai Chin, Dorothy Lyou Mantle
  • LEADLESS LEADFRAME AND SEMICONDUCTOR DEVICE PACKAGE THEREFROM
    Publication number: 20220139847
    Abstract: A semiconductor device package includes a leadless leadframe, and a plurality of terminal pads extending to a periphery of the leadframe. At least two of the plurality of terminal pads are interior extending terminal pads that include an interior portion having a shape including at least one curved portion and an exterior portion that extends to the periphery of the leadframe. An integrated circuit (IC) die having at least a semiconductor surface includes circuitry configured for at least one function having nodes connected to bond pads on the leadframe. There is a bonding arrangement between the plurality of terminal pads and the bond pads. A mold compound is for encapsulation of the semiconductor device package.
    Type: Application
    Filed: November 4, 2020
    Publication date: May 5, 2022
    Inventors: Mohammad Waseem Hussain, David Taiwai Chin, Dorothy Lyou Mantle