Abstract: In certain aspects, the present disclosure provides devices for loading a surgical bolster material. In accordance with some forms, the device includes a tray defining a guide channel for receipt of a bolster material. The guide channel may be configured to align and/or direct the device onto which the bolster material is to be loaded onto the bolster material.

Abstract: In certain aspects, the present disclosure provides devices for loading a surgical bolster material. In accordance with some forms, the device includes a tray defining a guide channel for receipt of a bolster material. The guide channel may be configured to align and/or direct the device onto which the bolster material is to be loaded onto the bolster material.

Abstract: The present invention utilizes a female coupler and male coupler to connect jewelry. The male coupler, featuring a stop, a shaft, and a buffer slides into a first channel within the shoot portion of a female coupler. The stop is rotated into position within a second channel of the scoop portion of the female coupler. The scoop portion secures the male coupler within the female coupler until a user forcibly rotates the stop to remove it from the scoop portion. The present invention only requires grasping of each of coupler and does not require squeezing any components.

Abstract: The present invention utilizes a female coupler and male coupler to connect jewelry. The male coupler, featuring a stop, a shaft, and a buffer slides into a first channel withing the shoot portion of a female coupler. The stop is rotated into position within a second channel of the scoop portion of the female coupler. The scoop portion secures the male coupler within the female coupler until a user forcibly rotates the stop to remove it from the scoop portion. The present invention only requires grasping of each of coupler and does not require squeezing any components.

Abstract: In certain aspects, the present disclosure provides devices for loading a surgical bolster material. In accordance with some forms, the device includes a tray defining a guide channel for receipt of a bolster material. The guide channel may be configured to align and/or direct the device onto which the bolster material is to be loaded onto the bolster material.

Abstract: A method and circuit module package for automated switch actuator insertion provides automated assembly of circuit modules having an integrated switch actuator, such as Secure Digital cards. A switch actuator is inserted automatically into a circuit module package housing by a robotic assembler. The housing and switch actuator have mating surfaces to retain the switch actuator within the housing so that shipping and subsequent assembly do not dislodge the switch actuator. The switch actuator/housing assembly can be contoured such that the switch actuator/housing assemblies may be stacked and then fed to a stack-loading feeder for joining of the actuator/housing assemblies to the remainder of the circuit module package housing. The switch actuator may be made from a material having a higher melting point than the housing so that ultrasonic welding may be performed on the circuit module package without joining the switch actuator permanently to the circuit module package assembly.

Abstract: A method and circuit module package for automated switch actuator insertion provides automated assembly of circuit modules having an integrated switch actuator, such as Secure Digital cards. A switch actuator is inserted automatically into a circuit module package housing by a robotic assembler. The housing and switch actuator have mating surfaces to retain the switch actuator within the housing so that shipping and subsequent assembly do not dislodge the switch actuator. The switch actuator/housing assembly can be contoured such that the switch actuator/housing assemblies may be stacked and then fed to a stack-loading feeder for joining of the actuator/housing assemblies to the remainder of the circuit module package housing. The switch actuator may be made from a material having a higher melting point than the housing so that ultrasonic welding may be performed on the circuit module package without joining the switch actuator permanently to the circuit module package assembly.