Abstract: In some embodiments, a method for determining a location of an unmanned system (UMS) can include: receiving data from a plurality of data sources, wherein the data sources include a geolocation sensor and at least one of an RF receiver, a RADAR system, a LIDAR system, a SONAR system, an infrared camera, a Simultaneous Location and Mapping Algorithm (SLAM) system, an inertial sensor, or an acoustic sensor; determining a reliability of one or more of the data sources based on the received data; assigning weights to the data sources based at least in part on the determination of the reliability of the one or more data sources; and determining the location of the UMS using the received data and the assigned weights.

Abstract: In some embodiments, a method for determining a location of an unmanned system (UMS) can include: receiving data from a plurality of data sources, wherein the data sources include a geolocation sensor and at least one of an RF receiver, a RADAR system, a LIDAR system, a SONAR system, an infrared camera, a Simultaneous Location and Mapping Algorithm (SLAM) system, an inertial sensor, or an acoustic sensor; determining a reliability of one or more of the data sources based on the received data; assigning weights to the data sources based at least in part on the determination of the reliability of the one or more data sources; and determining the location of the UMS using the received data and the assigned weights.

Abstract: A method of manufacturing a semiconductor component includes providing a substrate (110) having a first doping concentration and growing an epitaxial layer (120, 520) over the substrate. The epitaxial layer has a second doping concentration lower than the first doping concentration, and the epitaxial layer has at least two effective, as-grown thicknesses. The resulting composite substrate is suitable for an integrated circuit having both high and low voltage portions.