Patents by Inventor David Thomas Landsittel

David Thomas Landsittel has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Novel method and apparatus for hermetic encapsulation for integrated circuits and the like
    Patent number: 4100675
    Abstract: The base assembly of a dual in-line encapsulation package (DIP) is provided with a mounting surface such that the upper ends of the package pins are flat and are flush with the flat upper surface of the base enabling one-stage bonding of the integrated circuit chip to the inner leads of a lead frame and subsequently for one-stage bonding of the outer leads of the lead frame to the in-line pins of the encapsulation package.The configuration of the package lid and the hermetic sealing of the lid to the base yields a package having a double protection seal arrangement in which each pin seal is isolated from the encapsulated chip.
    Type: Grant
    Filed: November 1, 1976
    Date of Patent: July 18, 1978
    Assignee: Mansol Ceramics Company
    Inventor: David Thomas Landsittel