Abstract: Aspects described herein may allow for a plug-in device including a base having a plurality of apertures extending therethrough. A first PCB has a first surface defining a first plane, and a plurality of pins connected to and extending outwardly from the first surface, with each pin being received in one of the apertures of the base. A bracket secures the first PCB to the base. A second PCB is secured to the bracket, extending outwardly from the first PCB and defining a second plane, with the second plane being at an acute angle with respect to the first plane. An antenna housing is secured to the bracket and the second PCB and includes at least a first antenna. A cover is releasably secured to the base.

Abstract: Content is organized for brands by selecting a plurality of brand templates. After each selection, a set of properties is generated by applying a portion of settings of the respective brand template, with the remaining settings being overridden with settings for a channel communicating one of a plurality of presentations to a node of a network involved in the communication. The plurality of presentations may include different renditions of the same content. The properties may include sections configured for different focus areas and/or types of content associated with at tags to enable brand-level-targeting. Filters may be identified in the properties. Based on each of the identifications, a property from among the generated sets of properties may be selected based on comparisons with the associated tags.

Abstract: A detector array for a radiation system includes a radiation detection sub-assembly, a routing sub-assembly, and an electronics sub-assembly. The routing sub-assembly is disposed between the radiation detection sub-assembly and the electronics sub-assembly and includes one or more layers of shielding material. For example, the routing sub-assembly may include a printed circuit board having embedded therein a shielding material configured to shield the electronics sub-assembly from at least some radiation. In some embodiments, the shielding material defines at least one opening through which a conductive element(s) passes to deliver signals between the radiation detection sub-assembly and the electronics sub-assembly.

Abstract: Aspects described herein may allow for a plug-in device including a base having a plurality of apertures extending therethrough. A first PCB has a first surface defining a first plane, and a plurality of pins connected to and extending outwardly from the first surface, with each pin being received in one of the apertures of the base. A bracket secures the first PCB to the base. A second PCB is secured to the bracket, extending outwardly from the first PCB and defining a second plane, with the second plane being at an acute angle with respect to the first plane. An antenna housing is secured to the bracket and the second PCB and includes at least a first antenna. A cover is releasably secured to the base.

Abstract: A detector array for a radiation system includes a radiation detection sub-assembly, a routing sub-assembly, and an electronics sub-assembly. The routing sub-assembly is disposed between the radiation detection sub-assembly and the electronics sub-assembly and includes one or more layers of shielding material. For example, the routing sub-assembly may include a printed circuit board having embedded therein a shielding material configured to shield the electronics sub-assembly from at least some radiation. In some embodiments, the shielding material defines at least one opening through which a conductive element(s) passes to deliver signals between the radiation detection sub-assembly and the electronics sub-assembly.

Abstract: A detector array for a radiation system includes a radiation detection sub-assembly, a routing sub-assembly, and an electronics sub-assembly. The routing sub-assembly is disposed between the radiation detection sub-assembly and the electronics sub-assembly and includes one or more layers of shielding material. For example, the routing sub-assembly may include a printed circuit board having embedded therein a shielding material configured to shield the electronics sub-assembly from at least some radiation. In some embodiments, the shielding material defines at least one opening through which a conductive element(s) passes to deliver signals between the radiation detection sub-assembly and the electronics sub-assembly.

Abstract: A dual-energy detector array for a radiation system is provided. The dual-energy detector array includes a circuit board assembly having a first side and a second side. A first conversion package is coupled to the first side of the circuit board assembly and has a first effective photon energy. A second conversion package is coupled to the second side of the circuit board assembly and has a second effective photon energy different than the first effective photon energy. A radiation filtering material is disposed within the circuit board assembly between the first conversion package and the second conversion package. The radiation filtering material attenuates at least some of the radiation photons impinging thereon.

Abstract: A detector array for a radiation system includes a radiation detection sub-assembly, a routing sub-assembly, and an electronics sub-assembly. The routing sub-assembly is disposed between the radiation detection sub-assembly and the electronics sub-assembly and includes one or more layers of shielding material. For example, the routing sub-assembly may include a printed circuit board having embedded therein a shielding material configured to shield the electronics sub-assembly from at least some radiation. In some embodiments, the shielding material defines at least one opening through which a conductive element(s) passes to deliver signals between the radiation detection sub-assembly and the electronics sub-assembly.

Abstract: A dual-energy detector array for a radiation system is provided. The dual-energy detector array includes a circuit board assembly having a first side and a second side. A first conversion package is coupled to the first side of the circuit board assembly and has a first effective photon energy. A second conversion package is coupled to the second side of the circuit board assembly and has a second effective photon energy different than the first effective photon energy. A radiation filtering material is disposed within the circuit board assembly between the first conversion package and the second conversion package. The radiation filtering material attenuates at least some of the radiation photons impinging thereon.