Patents by Inventor David Trussell
David Trussell has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11764086Abstract: A substrate processing system configured to process substrates includes a substrate transport assembly that encloses a controlled environment defined within a continuous transport volume and at least two process modules coupled to the substrate transport assembly. The substrate transport assembly is configured to transport substrates to and from the at least two process modules through the continuous transport volume. At least two gas boxes are configured to deliver gas mixtures to the at least two process modules. An exhaust duct configured to selectively evacuate the at least two process modules through the at least two gas boxes. Surfaces of the at least two gas boxes include perforations configured to allow gases to flow from the at least two gas boxes into the exhaust duct.Type: GrantFiled: July 8, 2022Date of Patent: September 19, 2023Assignee: LAM RESEARCH CORPORATIONInventors: David Trussell, John Daugherty, Christopher J. Pena, Michael C. Kellogg, Klay Kunkel, Richard H. Gould
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Publication number: 20220344183Abstract: A substrate processing system configured to process substrates includes a substrate transport assembly that encloses a controlled environment defined within a continuous transport volume and at least two process modules coupled to the substrate transport assembly. The substrate transport assembly is configured to transport substrates to and from the at least two process modules through the continuous transport volume. At least two gas boxes are configured to deliver gas mixtures to the at least two process modules. An exhaust duct configured to selectively evacuate the at least two process modules through the at least two gas boxes. Surfaces of the at least two gas boxes include perforations configured to allow gases to flow from the at least two gas boxes into the exhaust duct.Type: ApplicationFiled: July 8, 2022Publication date: October 27, 2022Inventors: David TRUSSELL, John DAUGHERTY, Christopher J. PENA, Michael C. KELLOGG, Klay KUNKEL, Richard H. GOULD
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Patent number: 11393705Abstract: A substrate processing tool includes a wafer transport assembly that includes a first wafer transport module and extends along a longitudinal axis of the substrate processing tool. A plurality of process modules includes a first process module and a second process module arranged on opposite sides of the longitudinal axis of the substrate processing tool. Outer sides of the first wafer transport module are coupled to the first and second process modules, respectively. A service tunnel defined below the wafer transport assembly extends along the longitudinal axis from a front end of the substrate processing tool to a rear end of the substrate processing tool below the wafer transport assembly.Type: GrantFiled: September 18, 2020Date of Patent: July 19, 2022Assignee: Lam Research CorporationInventors: John E. Daugherty, David Trussell, Michael Kellogg, Christopher Pena, Richard H. Gould, Klay Kunkel
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Publication number: 20210005485Abstract: A substrate processing tool includes a wafer transport assembly that includes a first wafer transport module and extends along a longitudinal axis of the substrate processing tool. A plurality of process modules includes a first process module and a second process module arranged on opposite sides of the longitudinal axis of the substrate processing tool. Outer sides of the first wafer transport module are coupled to the first and second process modules, respectively. A service tunnel defined below the wafer transport assembly extends along the longitudinal axis from a front end of the substrate processing tool to a rear end of the substrate processing tool below the wafer transport assembly.Type: ApplicationFiled: September 18, 2020Publication date: January 7, 2021Inventors: John E. Daugherty, David Trussell, Michael Kellogg, Christopher Pena, Richard H. Gould, Klay Kunkel
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Patent number: 10804079Abstract: An active showerhead used for a plasma reactor is described. The active showerhead includes a plurality of substrate layers. The substrate layers include at least one actuator and transfer component. The actuator and transfer component is coupled to a gas line via a gas channel. The active showerhead further includes an electrode layer located below the substrate layers. The electrode layer and the actuator and transfer component both share an opening. The actuator and transfer component allows passage of one or more process gases received from the gas line and the gas channel into the opening without the need for a conventional gas box.Type: GrantFiled: August 19, 2019Date of Patent: October 13, 2020Assignee: Lam Research CorporationInventors: Mariusch Gregor, Thorsten Lill, David Trussell
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Patent number: 10790174Abstract: A wafer transport assembly includes a first wafer transport module and a second wafer transport module. A buffer module, arranged between the first wafer transport module and the second wafer transport module, includes a first buffer stack and a second buffer stack. Outer sides of the first wafer transport module are coupled to first and second process modules, respectively, and outer sides of the second wafer transport module are coupled to third and fourth process modules, respectively. The first wafer transport module, the second wafer transport module, and the buffer module define a continuous wafer transport volume providing a controlled environment within the wafer transport assembly.Type: GrantFiled: April 12, 2018Date of Patent: September 29, 2020Assignee: LAM RESEARCH CORPORATIONInventors: John Daugherty, David Trussell, Michael Kellogg, Christopher Pena, Richard H. Gould, Klay Kunkel
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Publication number: 20190371573Abstract: An active showerhead used for a plasma reactor is described. The active showerhead includes a plurality of substrate layers. The substrate layers include at least one actuator and transfer component. The actuator and transfer component is coupled to a gas line via a gas channel. The active showerhead further includes an electrode layer located below the substrate layers. The electrode layer and the actuator and transfer component both share an opening. The actuator and transfer component allows passage of one or more process gases received from the gas line and the gas channel into the opening without the need for a conventional gas box.Type: ApplicationFiled: August 19, 2019Publication date: December 5, 2019Inventors: Mariusch Gregor, Thorsten Lill, David Trussell
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Patent number: 10403476Abstract: An active showerhead used for a plasma reactor is described. The active showerhead includes a plurality of substrate layers. The substrate layers include at least one actuator and transfer component. The actuator and transfer component is coupled to a gas line via a gas channel. The active showerhead further includes an electrode layer located below the substrate layers. The electrode layer and the actuator and transfer component both share an opening. The actuator and transfer component allows passage of one or more process gases received from the gas line and the gas channel into the opening without the need for a conventional gas box.Type: GrantFiled: November 9, 2016Date of Patent: September 3, 2019Assignee: Lam Research CorporationInventors: Mariusch Gregor, Thorsten Lill, David Trussell
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Patent number: 10304707Abstract: A load lock assembly includes a first load lock connected between an equipment front end module (EFEM) and a wafer transport module, the EFEM being at a lab ambient condition, the wafer transport module being at a vacuum condition, the wafer transport module being part of a wafer transport assembly that is configured to transport wafers to and from one or more process modules that are connected to the wafer transport assembly; a second load lock disposed over the first load lock, the second load lock connected between the EFEM and the wafer transport module; a post-processing module disposed over the second load lock, the post-processing module configured for performing a post-processing operation on a processed wafer that has been processed in at least one of the process modules that are connected to the wafer transport assembly, the post-processing module being configured for connection to the wafer transport module.Type: GrantFiled: October 20, 2015Date of Patent: May 28, 2019Assignee: LAM RESEARCH CORPORATIONInventors: David Trussell, Richard Gould, John Daugherty
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Publication number: 20180233387Abstract: A wafer transport assembly includes a first wafer transport module and a second wafer transport module. A buffer module, arranged between the first wafer transport module and the second wafer transport module, includes a first buffer stack and a second buffer stack. Outer sides of the first wafer transport module are coupled to first and second process modules, respectively, and outer sides of the second wafer transport module are coupled to third and fourth process modules, respectively. The first wafer transport module, the second wafer transport module, and the buffer module define a continuous wafer transport volume providing a controlled environment within the wafer transport assembly.Type: ApplicationFiled: April 12, 2018Publication date: August 16, 2018Inventors: John DAUGHERTY, David TRUSSELL, Michael KELLOGG, Christopher PENA, Richard H. GOULD, Klay KUNKEL
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Patent number: 10014196Abstract: A wafer transport assembly includes first and second wafer transport modules, and a buffer module coupled between the first and second wafer transport modules. The first and second wafer transport modules and the buffer module are aligned in a single directional axis. The buffer module includes a first buffer stack positioned at a first lateral end of the buffer module, and a second buffer stack positioned at a second lateral end of the buffer module. The first lateral end of the buffer module defines a first side protrusion nested between the first and second wafer transport modules and first and second process modules. The second lateral end of the buffer module defines a second side protrusion that is nested between the first and second wafer transport modules and third and fourth process modules. The first and second wafer transport modules and the buffer module define a continuous controlled environment.Type: GrantFiled: October 20, 2015Date of Patent: July 3, 2018Assignee: LAM RESEARCH CORPORATIONInventors: John Daugherty, David Trussell, Michael Kellogg, Christopher Pena, Richard Gould, Klay Kunkel
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Publication number: 20180130640Abstract: An active showerhead used for a plasma reactor is described. The active showerhead includes a plurality of substrate layers. The substrate layers include at least one actuator and transfer component. The actuator and transfer component is coupled to a gas line via a gas channel. The active showerhead further includes an electrode layer located below the substrate layers. The electrode layer and the actuator and transfer component both share an opening. The actuator and transfer component allows passage of one or more process gases received from the gas line and the gas channel into the opening without the need for a conventional gas box.Type: ApplicationFiled: November 9, 2016Publication date: May 10, 2018Inventors: Mariusch Gregor, Thorsten Lill, David Trussell
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Patent number: 9929028Abstract: A system for processing substrates is provided, comprising: a wafer transport assembly that is configured to transport wafers to and from one or more process modules, the wafer transport assembly having at least one wafer transport module, wherein lateral sides of the at least one wafer transport module are configured to couple to the one or more process modules; a service floor defined below the wafer transport assembly, the service floor being defined at a height that is less than a height of a fabrication facility floor in which the system is disposed.Type: GrantFiled: October 18, 2016Date of Patent: March 27, 2018Assignee: Lam Research CorporationInventors: David Trussell, John Daugherty, Michael Kellogg, Christopher Pena, Richard Gould, Klay Kunkel
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Publication number: 20170110354Abstract: A wafer transport assembly includes first and second wafer transport modules, and a buffer module coupled between the first and second wafer transport modules. The first and second wafer transport modules and the buffer module are aligned in a single directional axis. The buffer module includes a first buffer stack positioned at a first lateral end of the buffer module, and a second buffer stack positioned at a second lateral end of the buffer module. The first lateral end of the buffer module defines a first side protrusion nested between the first and second wafer transport modules and first and second process modules. The second lateral end of the buffer module defines a second side protrusion that is nested between the first and second wafer transport modules and third and fourth process modules. The first and second wafer transport modules and the buffer module define a continuous controlled environment.Type: ApplicationFiled: October 20, 2015Publication date: April 20, 2017Inventors: John Daugherty, David Trussell, Michael Kellogg, Christopher Pena, Richard Gould, Klay Kunkel
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Publication number: 20170110351Abstract: A load lock assembly includes a first load lock connected between an equipment front end module (EFEM) and a wafer transport module, the EFEM being at a lab ambient condition, the wafer transport module being at a vacuum condition, the wafer transport module being part of a wafer transport assembly that is configured to transport wafers to and from one or more process modules that are connected to the wafer transport assembly; a second load lock disposed over the first load lock, the second load lock connected between the EFEM and the wafer transport module; a post-processing module disposed over the second load lock, the post-processing module configured for performing a post-processing operation on a processed wafer that has been processed in at least one of the process modules that are connected to the wafer transport assembly, the post-processing module being configured for connection to the wafer transport module.Type: ApplicationFiled: October 20, 2015Publication date: April 20, 2017Inventors: David Trussell, Richard Gould, John Daugherty
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Publication number: 20170110350Abstract: A system for processing substrates is provided, comprising: a wafer transport assembly that is configured to transport wafers to and from one or more process modules, the wafer transport assembly having at least one wafer transport module, wherein lateral sides of the at least one wafer transport module are configured to couple to the one or more process modules; a service floor defined below the wafer transport assembly, the service floor being defined at a height that is less than a height of a fabrication facility floor in which the system is disposed.Type: ApplicationFiled: October 18, 2016Publication date: April 20, 2017Inventors: David Trussell, John Daugherty, Michael Kellogg, Christopher Pena, Richard Gould, Klay Kunkel
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Patent number: 9502275Abstract: A system for processing substrates is provided, comprising: a wafer transport assembly that is configured to transport wafers to and from one or more process modules, the wafer transport assembly having at least one wafer transport module, wherein lateral sides of the at least one wafer transport module are configured to couple to the one or more process modules; a service floor defined below the wafer transport assembly, the service floor being defined at a height that is less than a height of a fabrication facility floor in which the system is disposed.Type: GrantFiled: October 20, 2015Date of Patent: November 22, 2016Assignee: Lam Research CorporationInventors: David Trussell, John Daugherty, Michael Kellogg, Christopher Pena, Richard Gould, Klay Kunkel
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Publication number: 20160086864Abstract: Provided herein are methods and apparatuses for cleaning wafers by coating an active surface of the wafer with a film of water to clean the wafer, delivering gas from a gas nozzle to the center of the active surface to break a film of water on the active surface to form a wet-dry boundary while spinning the wafer, and moving the gas nozzle radially outward from the center to the edge of the active surface of the wafer by following the wet-dry boundary. Tracking devices, such as cameras or charge-coupled devices, and systems may be used with an apparatus for cleaning wafers by tracking the wet-dry boundary on the wafer to move the gas nozzle to follow the wet-dry boundary. Cleaning apparatuses provided herein may be integrated with etching tools.Type: ApplicationFiled: September 24, 2014Publication date: March 24, 2016Inventors: Andreas Fischer, Thorsten Lill, David Trussell
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Patent number: 8573153Abstract: An improved upper electrode system has a multi-part electrode in which a central portion of the electrode having high wear is replaceable independent of an outer peripheral portion of the electrode. The upper electrode can be used in plasma processing systems for processing semiconductor substrates, such as by etching or CVD. The multi-part upper electrode system is particularly useful for large size wafer processing chambers, such as 300 mm wafer processing chambers for which monolithic electrodes are unavailable or costly.Type: GrantFiled: November 24, 2010Date of Patent: November 5, 2013Assignee: Lam Research CorporationInventors: Andreas Fischer, William S. Kennedy, Peter Loewenhardt, David Trussell
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Patent number: 8500952Abstract: Plasma confinement ring assemblies are provided that include confinement rings adapted to reach sufficiently high temperatures on plasma-exposed surfaces of the rings to avoid polymer deposition on those surfaces. The plasma confinement rings include thermal chokes adapted to localize heating at selected portions of the rings that include the plasma exposed surfaces. The thermal chokes reduce heat conduction from those portions to other portions of the rings, which causes selected portions of the rings to reach desired temperatures during plasma processing.Type: GrantFiled: August 14, 2012Date of Patent: August 6, 2013Assignee: Lam Research CorporationInventors: Rajinder Dhindsa, Felix Kozakevich, James H. Rogers, David Trussell