Patents by Inventor David V. Childers

David V. Childers has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Process and system for quality management and analysis of via drilling
    Patent number: 8501021
    Abstract: A process for laser forming a blind via in at least one layer of a circuit substrate having a plurality of capture pads of varying geometry can include, for at least one blind via to be formed in at least one layer of a circuit substrate, evaluating a capture pad geometry value (such as area and/or volume) within a predetermined distance from a drilling location with respect to a blind via geometry value (such as area and/or volume) to be formed at the drilling location. The process can include setting at least one laser operating parameter based on the evaluation in order to obtain a desired capture pad appearance after blind via formation. The process can include imaging a capture pad area defined as an area within a predetermined distance from a blind via drilling location in at least one layer of a circuit substrate, quantifying at least one appearance value for the imaged capture pad area, and determining an acceptability of the imaged capture pad areas based on the quantified appearance value.
    Type: Grant
    Filed: March 27, 2009
    Date of Patent: August 6, 2013
    Assignee: Electro Scientific Industries, Inc.
    Inventors: Hisashi Matsumoto, Mark Singer, Leo Baldwin, Jeffrey E. Howerton, David V. Childers
  • PROCESS AND SYSTEM FOR QUALITY MANAGEMENT AND ANALYSIS OF VIA DRILLING
    Publication number: 20090179017
    Abstract: A process for laser forming a blind via in at least one layer of a circuit substrate having a plurality of capture pads of varying geometry can include, for at least one blind via to be formed in at least one layer of a circuit substrate, evaluating a capture pad geometry value (such as area and/or volume) within a predetermined distance from a drilling location with respect to a blind via geometry value (such as area and/or volume) to be formed at the drilling location. The process can include setting at least one laser operating parameter based on the evaluation in order to obtain a desired capture pad appearance after blind via formation. The process can include imaging a capture pad area defined as an area within a predetermined distance from a blind via drilling location in at least one layer of a circuit substrate, quantifying at least one appearance value for the imaged capture pad area, and determining an acceptability of the imaged capture pad areas based on the quantified appearance value.
    Type: Application
    Filed: March 27, 2009
    Publication date: July 16, 2009
    Applicant: Electro Scientific Industries, Inc.
    Inventors: Hisashi Matsumoto, Mark Singer, Leo Baldwin, Jeffrey E. Howerton, David V. Childers
  • Process and system for quality management and analysis of via drilling
    Patent number: 7544304
    Abstract: A process for laser forming a blind via in at least one layer of a circuit substrate having a plurality of capture pads of varying geometry can include, for at least one blind via to be formed in at least one layer of a circuit substrate, evaluating a capture pad geometry value (such as area and/or volume) within a predetermined distance from a drilling location with respect to a blind via geometry value (such as area and/or volume) to be formed at the drilling location. The process can include setting at least one laser operating parameter based on the evaluation in order to obtain a desired capture pad appearance after blind via formation. The process can include imaging a capture pad area defined as an area within a predetermined distance from a blind via drilling location in at least one layer of a circuit substrate, quantifying at least one appearance value for the imaged capture pad area, and determining an acceptability of the imaged capture pad areas based on the quantified appearance value.
    Type: Grant
    Filed: July 11, 2006
    Date of Patent: June 9, 2009
    Assignee: Electro Scientific Industries, Inc.
    Inventors: Hisashi Matsumoto, Mark Singer, Leo Baldwin, Jeffrey E. Howerton, David V. Childers
  • Process and system for quality management and analysis of via drilling
    Publication number: 20080011715
    Abstract: A process for laser forming a blind via in at least one layer of a circuit substrate having a plurality of capture pads of varying geometry can include, for at least one blind via to be formed in at least one layer of a circuit substrate, evaluating a capture pad geometry value (such as area and/or volume) within a predetermined distance from a drilling location with respect to a blind via geometry value (such as area and/or volume) to be formed at the drilling location. The process can include setting at least one laser operating parameter based on the evaluation in order to obtain a desired capture pad appearance after blind via formation. The process can include imaging a capture pad area defined as an area within a predetermined distance from a blind via drilling location in at least one layer of a circuit substrate, quantifying at least one appearance value for the imaged capture pad area, and determining an acceptability of the imaged capture pad areas based on the quantified appearance value.
    Type: Application
    Filed: July 11, 2006
    Publication date: January 17, 2008
    Applicant: Electro Scientific Industies, Inc.
    Inventors: Hisashi Matsumoto, Mark Singer, Leo Baldwin, Jeffrey E. Howerton, David V. Childers