Patents by Inventor David V. Kyaw

David V. Kyaw has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Thermal interface material and solder preforms
    Patent number: 7663242
    Abstract: A solder preform having multiple layers including a solder layer filled with additives interposed between two unfilled layers for improved wettability. A solder preform having a sphere which contains a solder material filled with additives, and an unfilled surface layer for improved wettability. A thermal interface material having a bonding component and an additive component which is a CTE modifying component and/or a thermal conductivity enhancement component. Active solders containing intrinsic oxygen getters.
    Type: Grant
    Filed: March 6, 2007
    Date of Patent: February 16, 2010
    Inventors: Brian G. Lewis, Bawa Singh, John P. Laughlin, David V. Kyaw, Anthony E. Ingham, Attiganal N. Sreeram, Leszek Hozer, Michael J. Liberatore, Gerard R. Minogue
  • Thermal interface material and solder preforms
    Patent number: 7187083
    Abstract: A solder preform having multiple layers including a solder layer filled with additives interposed between two unfilled layers for improved wettability. A solder preform having a sphere which contains a solder material filled with additives, and an unfilled surface layer for improved wettability. A thermal interface material having a bonding component and an additive component which is a CTE modifying component and/or a thermal conductivity enhancement component. Active solders containing intrinsic oxygen getters.
    Type: Grant
    Filed: November 25, 2003
    Date of Patent: March 6, 2007
    Assignee: Fry's Metals, Inc.
    Inventors: Brian G. Lewis, Bawa Singh, John P. Laughlin, David V. Kyaw, Anthony E. Ingham, Attiganal N. Sreeram, Leszek Hozer, Michael J. Liberatore, Gerard R. Minogue
  • Thermal interface material and solder preforms
    Publication number: 20040200879
    Abstract: A solder preform having multiple layers including a solder layer filled with additives interposed between two unfilled layers for improved wettability. A solder preform having a sphere which contains a solder material filled with additives, and an unfilled surface layer for improved wettability. A thermal interface material having a bonding component and an additive component which is a CTE modifying component and/or a thermal conductivity enhancement component. Active solders containing intrinsic oxygen getters.
    Type: Application
    Filed: November 25, 2003
    Publication date: October 14, 2004
    Applicant: Fry's Metals, Inc.
    Inventors: Brian G. Lewis, Bawa Singh, John P. Laughlin, David V. Kyaw, Anthony E. Ingham, Attiganal N. Sreeram, Leszek Hozer, Michael J. Liberatore, Gerard R. Minogue
  • Friction-resistant alloy for use as a bearing
    Publication number: 20040076541
    Abstract: A friction-resistant alloy being a tin matrix containing copper, antimony, and between about 0.10% and about 2% by weight bismuth; and an industrial bearing component having this alloy on a wear surface.
    Type: Application
    Filed: October 22, 2002
    Publication date: April 22, 2004
    Inventors: John P. Laughlin, David V. Kyaw