Patents by Inventor David V. Spaulding

David V. Spaulding has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Attaching components to a printed circuit card
    Patent number: 6878305
    Abstract: Coupling components to an underlying substrate using a composition of a polymer and magnetic material particles. Upon applying the composition between the component and the printed circuit board, the composition may be subjected to a magnetic field to align the magnetic material particles into a conductive path between the component and the underlying substrate. At the same time the polymer-based material may be cured or otherwise solidified to affix the conductive path formed by the magnetic material particles.
    Type: Grant
    Filed: October 28, 2003
    Date of Patent: April 12, 2005
    Assignee: Intel Corporation
    Inventors: George Hsieh, Terrance J. Dishongh, Norman J. Armendariz, David V. Spaulding
  • Attaching components to a printed circuit card
    Patent number: 6875367
    Abstract: Coupling components to an underlying substrate using a composition of a polymer and magnetic material particles. Upon applying the composition between the component and the printed circuit board, the composition may be subjected to a magnetic field to align the magnetic material particles into a conductive path between the component and the underlying substrate. At the same time the polymer-based material may be cured or otherwise solidified to affix the conductive path formed by the magnetic material particles.
    Type: Grant
    Filed: October 28, 2003
    Date of Patent: April 5, 2005
    Assignee: Intel Corporation
    Inventors: George Hsieh, Terrance J. Dishongh, Norman J. Armendariz, David V. Spaulding
  • Attaching components to a printed circuit card
    Patent number: 6818155
    Abstract: Coupling components to an underlying substrate using a composition of a polymer and magnetic material particles. Upon applying the composition between the component and the printed circuit board, the composition may be subjected to a magnetic field to align the magnetic material particles into a conductive path between the component and the underlying substrate. At the same time the polymer-based material may be cured or otherwise solidified to affix the conductive path formed by the magnetic material particles.
    Type: Grant
    Filed: January 2, 2002
    Date of Patent: November 16, 2004
    Assignee: Intel Corporation
    Inventors: George Hsieh, Terrance J. Dishongh, Norman J. Armendariz, David V. Spaulding
  • Attaching components to a printed circuit card
    Publication number: 20040109974
    Abstract: Coupling components to an underlying substrate using a composition of a polymer and magnetic material particles. Upon applying the composition between the component and the printed circuit board, the composition may be subjected to a magnetic field to align the magnetic material particles into a conductive path between the component and the underlying substrate. At the same time the polymer-based material may be cured or otherwise solidified to affix the conductive path formed by the magnetic material particles.
    Type: Application
    Filed: October 28, 2003
    Publication date: June 10, 2004
    Inventors: George Hsieh, Terrance J. Dishongh, Norman J. Armendariz, David V. Spaulding
  • Attaching components to a printed circuit card
    Publication number: 20040087173
    Abstract: Coupling components to an underlying substrate using a composition of a polymer and magnetic material particles. Upon applying the composition between the component and the printed circuit board, the composition may be subjected to a magnetic field to align the magnetic material particles into a conductive path between the component and the underlying substrate. At the same time the polymer-based material may be cured or otherwise solidified to affix the conductive path formed by the magnetic material particles.
    Type: Application
    Filed: October 28, 2003
    Publication date: May 6, 2004
    Inventors: George Hsieh, Terrance J. Dishongh, Norman J. Armendariz, David V. Spaulding
  • Attaching components to a printed circuit card
    Publication number: 20030121602
    Abstract: Coupling components to an underlying substrate using a composition of a polymer and magnetic material particles. Upon applying the composition between the component and the printed circuit board, the composition may be subjected to a magnetic field to align the magnetic material particles into a conductive path between the component and the underlying substrate. At the same time the polymer-based material may be cured or otherwise solidified to affix the conductive path formed by the magnetic material particles.
    Type: Application
    Filed: January 2, 2002
    Publication date: July 3, 2003
    Inventors: George Hsieh, Terrance J. Dishongh, Norman J. Armendariz, David V. Spaulding