Abstract: A radiation detector 10 has a base 12 and a window 16 that define a vacuum chamber 20. Within the vacuum chamber 20 is a temperature controlled filter 32 and a focal plane array (FPA) 22 defining a gap h therebetween. The filter 32 is heat sunk to a readout integrated circuit (ROIC) 24 and thermoelectric elements 28 to inhibit heat transfer from non-scene sources 38, 40 to the FPA 22. The temperature controlled filter 32 may also incorporate a bandpass filter to reflect all sources of radiation not within the desired wavelength region of interest. The temperature controlled filter 32 is maintained at substantially the same temperature as the FPA 22.

Abstract: A radiation detector (10) has a base (30), a frame (48), a window (46), and solder layers (50, 52) formed from a solder pre-form (58, 60) to define a vacuum chamber (56). Feedthroughs (18, 40, 44) penetrate the base (30) for electrical connection to internal components. A method for sealing the detector (10) aligns a lower detector assembly (62), the frame (48) the window (46), and the solder pre-forms (58, 60) in a non-sealed relation within a processing chamber (80, 94). High temperature and low pressure is imposed, and the getter (42) is activated by resistive heating imposed by current leads (88). The window (46), frame (48), and lower detector assembly (62) are then pressed together and sealed by the liquefied solder pre-forms (58, 60). The method eliminates the need for a seal port, combines several steps within the processing chamber (80, 94), and eliminates certain prior art cleaning steps.