Patents by Inventor David Vender

David Vender has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Apparatus for hot wall reactive ion etching using a dielectric or metallic liner with temperature control to achieve process stability
    Patent number: 5798016
    Abstract: The present invention relates to a method and apparatus for etching semiconductor devices where the undesirable deposition of films on the internal surfaces of the apparatus are prevented during the etching process. The system for etching devices provides an etching chamber having a deposition resistant surface, a holder for holding the device to be etched, and a heater for heating the deposition resistant surface to a temperature between 100.degree. C. to 600.degree. C. to impede the formation of films on the walls of the chamber. The etching system may further include the deposition resistant surface surrounding the holder while not interfering with the plasma used to etch the substrate.
    Type: Grant
    Filed: March 8, 1994
    Date of Patent: August 25, 1998
    Assignee: International Business Machines Corporation
    Inventors: Gottlieb Stefan Oehrlein, David Vender, Ying Zhang, Marco Haverlag
  • Method for hot wall reactive ion etching using a dielectric or metallic liner with temperature control to achieve process stability
    Patent number: 5637237
    Abstract: The present invention relates to a method and apparatus for etching semiconductor devices where the undesirable deposition of films on the internal surfaces of the apparatus are prevented during the etching process. The system for etching devices provides an etching chamber having a deposition resistant surface, a holder for holding the device to be etched, and a heater for heating the deposition resistant surface to a temperature between 100 C to 600 C to impede the formation of films on the walls of the chamber. The etching system may further include the deposition resistant surface surrounding the holder while not interfering with the plasma used to etch the substrate.
    Type: Grant
    Filed: June 7, 1995
    Date of Patent: June 10, 1997
    Assignee: International Business Machines Corporation
    Inventors: Gottlieb S. Oehrlein, David Vender, Ying Zhang, Marco Haverlag