Abstract: A method of providing an electrical connection to a coil of wire in an encapsulated magnetic device of the type having one length of wire formed in a coil about a core and disposed within a relatively rigid encapsulating material is disclosed. The method includes providing a lead wire to be connected to the length of wire and extend from the encapsulated magnetic device for connection to other electrical circuitry and bending that lead wire into and "S" shape in a region near where the lead wire is to exit the magnetic device. The typically rigid encapsulating material is excluded from a region surrounding the region of the bend by filling the region with an elastomer so that the lead wire may experience movement within the device. The elastomer may be a room temperature vulcanizable material.