Abstract: Disclosed is a wafer handling device for a sputtering system where wafers, used in the manufacture of integrated circuits, are placed in a loading chamber, removed from the loading chamber and conveyed by a conveying device through a transportation chamber where they are individually picked from the conveying device by the wafer handling device and placed on a rotating table within the system sputtering chamber to be sputter processed. Concurrently within the placing of one unprocessed wafer on the rotating table, a processed wafer is picked from the rotating table and placed on a second conveying device or the same conveying device which brought unprocessed wafers to the wafer handling device for return to the loading chamber to be removed from the sputtering system for further handling and processing.