Patents by Inventor David W. Chu

David W. Chu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • 3-(1H-pyrazol-4-yl)pyridine allosteric modulators of the M4 muscarinic acetylcholine receptor
    Patent number: 11970479
    Abstract: The present invention is directed to cinnolinyl and quinolinyl pyrazol-4-yl-pyridine compounds which are allosteric modulators of the M4 muscarinic acetylcholine receptor. The present invention is also directed to uses of the compounds described herein in the potential treatment or prevention of neurological and psychiatric disorders and diseases in which M4 muscarinic acetylcholine receptors are involved. The present invention is also directed to compositions comprising these compounds. The present invention is also directed to uses of these compositions in the potential prevention or treatment of such diseases in which M4 muscarinic acetylcholine receptors are involved.
    Type: Grant
    Filed: October 24, 2019
    Date of Patent: April 30, 2024
    Assignees: Merck Sharp & Dohme LLC, MSD R&D (China) Co. LTD.
    Inventors: John J. Acton, III, Melissa Egbertson, Xiaolei Gao, Scott T. Harrison, Timothy J. Henderson, Michael Man-Chu Lo, Robert D. Mazzola, Jr., Zhaoyang Meng, James Mulhearn, Vanessa L. Rada, Jeffrey W. Schubert, Oleg B. Selyutin, David M. Tellers, Ling Tong, Fengqi Zhang, Jianming Bao, Chunsing Li
  • Monolithic multi-module electronics chassis with multi-planar embedded fluid cooling channels
    Patent number: 9468131
    Abstract: A cooling system for cooling a heat source includes a monolithic structure having a plurality of embedded cooling channels arranged in a multi-planar arrangement, the embedded cooling channels configured to carry a cooling fluid to a plurality of locations throughout the monolithic structure, the cooling fluid configured to absorb heat transferred from a heat source associated with the monolithic structure. The monolithic structure is formed integrally with the embedded cooling channels using an additive manufacturing process.
    Type: Grant
    Filed: April 16, 2014
    Date of Patent: October 11, 2016
    Assignee: Raytheon Company
    Inventors: David B. Brandt, Robert K. Dodds, David W. Chu, Alicia G. Allen, Gregory P. Schaefer
  • MONOLITHIC MULTI-MODULE ELECTRONICS CHASSIS WITH MULTI-PLANAR EMBEDDED FLUID COOLING CHANNELS
    Publication number: 20150305198
    Abstract: A cooling system for cooling a heat source includes a monolithic structure having a plurality of embedded cooling channels arranged in a multi-planar arrangement, the embedded cooling channels configured to carry a cooling fluid to a plurality of locations throughout the monolithic structure, the cooling fluid configured to absorb heat transferred from a heat source associated with the monolithic structure. The monolithic structure is formed integrally with the embedded cooling channels using an additive manufacturing process.
    Type: Application
    Filed: April 16, 2014
    Publication date: October 22, 2015
    Applicant: Raytheon Company
    Inventors: David B. Brandt, Robert K. Dodds, David W. Chu, Alicia G. Allen, Gregory P. Schaefer