Abstract: A flexible cooling loop for providing a thermal path between a heat source and a heat sink includes a plurality of mechanically rigid tubing sections configured for being in thermal contact with the heat source and the heat sink. The cooling loop further includes a plurality if mechanically flexible tubing sections configured for connecting the mechanically rigid tubing sections to form the loop. The loop is configured for containing a liquid. The liquid is configured for being circulated within the loop for promoting transfer of thermal energy from the heat source to the heat sink via the loop.

Abstract: The present invention is a thermal spreader for providing a high effective thermal conductivity between a heat source and a heat sink. The thermal spreader may include a mechanically flexible substrate. The mechanically flexible substrate may be at least partially constructed of organic materials. The mechanically flexible substrate may form an internal channel which is configured for containing an electrically-conductive liquid. The thermal spreader may further include a pump. The pump may be configured for being connected to the substrate and for circulating the electrically-conductive liquid within the internal channel. The thermal spreader may further include one or more thermally-conductive, rigid metal inserts. Each insert may be configured for being in thermal contact with the electrically-conductive liquid and the substrate and for promoting heat transfer between the thermal spreader and the electrically-conductive liquid.

Abstract: The present invention is a method for fabricating a thermal spreader. The method may include laminating a plurality of layer portions together to fabricate a mechanically flexible substrate. The method may further include providing an internal channel within the mechanically flexible substrate, the internal channel configured for containing an electrically-conductive liquid, the internal channel being further configured to allow for closed-loop flow of the electrically-conductive liquid within the internal channel. The method may further include integrating a pump with the mechanically flexible substrate. The method may further include fabricating a plurality of rigid metal inserts. The method may further include forming a plurality of extension portions on a surface of each rigid metal insert included in the plurality of rigid metal inserts. The method may further include connecting the plurality of rigid metal inserts to the mechanically flexible substrate.

Abstract: A circuit board includes a pump and a channel. The channel includes a liquid metal and a coating. The liquid metal is pumped through the channel by the pump and the coating reduces diffusion and chemical reaction between the liquid metal and at least portions of the channel. The liquid metal can carry thermal energy to act as a heat transfer mechanism between two or more locations on the substrate. The substrate may include electrical interconnects to allow electrical components to be populated onto the substrate to form an electronics assembly.

Abstract: The present invention is a flexible liquid cooling loop for providing a thermal path between a heat source and a heat sink. The cooling loop includes a plurality of mechanically rigid tubing sections configured for being in thermal contact with the heat source and the heat sink. The cooling loop further includes a plurality of mechanically flexible tubing sections configured for connecting the mechanically rigid sections to form the loop. The loop is configured for containing a liquid. The liquid is configured for being circulated within the loop for promoting transfer of thermal energy from the heat source to the heat sink via the loop.

Abstract: The present invention is a thermal spreader for providing a high effective thermal conductivity between a heat source and a heat sink. The thermal spreader may include a mechanically flexible substrate. The mechanically flexible substrate may be at least partially constructed of organic materials. The mechanically flexible substrate may form an internal channel which is configured for containing an electrically-conductive liquid. The thermal spreader may further include a pump. The pump may be configured for being connected to the substrate and for circulating the electrically-conductive liquid within the internal channel. The thermal spreader may further include one or more thermally-conductive, rigid metal inserts. Each insert may be configured for being in thermal contact with the electrically-conductive liquid and the substrate and for promoting heat transfer between the thermal spreader and the electrically-conductive liquid.

Abstract: The present invention is a method for fabricating a thermal spreader. The method may include laminating a plurality of layer portions together to fabricate a mechanically flexible substrate. The method may further include providing an internal channel within the mechanically flexible substrate, the internal channel configured for containing an electrically-conductive liquid, the internal channel being further configured to allow for closed-loop flow of the electrically-conductive liquid within the internal channel. The method may further include integrating a pump with the mechanically flexible substrate. The method may further include fabricating a plurality of rigid metal inserts. The method may further include forming a plurality of extension portions on a surface of each rigid metal insert included in the plurality of rigid metal inserts. The method may further include connecting the plurality of rigid metal inserts to the mechanically flexible substrate.

Abstract: A circuit board includes a pump and a channel. The channel includes a liquid metal and a coating. The liquid metal is pumped through the channel by the pump and the coating reduces diffusion and chemical reaction between the liquid metal and at least portions of the channel. The liquid metal can carry thermal energy to act as a heat transfer mechanism between two or more locations on the substrate. The substrate may include electrical interconnects to allow electrical components to be populated onto the substrate to form an electronics assembly.