Patents by Inventor David W. Hixon

David W. Hixon has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7895362
    Abstract: Embodiments of the present invention address deficiencies of the art in respect to EDI enveloping and provide a method, system and computer program product for multiple message source EDI enveloping with batching support. In one embodiment of the invention, a method for multi-format EDI enveloping can include receiving messages from multiple concurrent message sources, transforming the received messages into an EDI format, inserting the transformed messages into a minimal number of envelopes, and forwarding the envelopes as an EDI interchange to designated trading partners.
    Type: Grant
    Filed: March 7, 2007
    Date of Patent: February 22, 2011
    Assignee: International Business Machines Corporation
    Inventors: Rayne S. Anderson, Ashutosh Arora, Tuan T. Dang, Raja Das, David W. Hixon, Sreedhar Janaswamy
  • Publication number: 20080222651
    Abstract: Embodiments of the present invention address deficiencies of the art in respect to EDI enveloping and provide a method, system and computer program product for multiple message source EDI enveloping with batching support. In one embodiment of the invention, a method for multi-format EDI enveloping can include receiving messages from multiple concurrent message sources, transforming the received messages into an EDI format, inserting the transformed messages into a minimal number of envelopes, and forwarding the envelopes as an EDI interchange to designated trading partners.
    Type: Application
    Filed: March 7, 2007
    Publication date: September 11, 2008
    Inventors: Rayne S. Anderson, Ashutosh Arora, Tuan T. Dang, Raja Das, David W. Hixon, Sreedhar Janaswamy