Abstract: A horticultural container filling apparatus has a hopper to selectively dispense soil through an exit. A two-tier strip conveyor assembly has a plurality of narrow conveyor belts coupled to a motor for translating the narrow conveyor belts in a first direction along a first plane below the exit of the hopper. The narrow conveyor belts spaced apart, defining one or more gaps. A plurality of support rails support and guide the narrow conveyor belts along the first plane and are configured to support and convey a container on the narrow conveyor belts in the first direction. The container receives a portion of the soil dispensed from the exit of the hopper, and the gaps pass a remaining portion of soil not received by the container to a second plane below the first plane. A catch conveyor belt along the second plane receives and translates the remaining portion of soil in a second direction along the second plane.

Abstract: A horticultural container filling apparatus has a hopper to selectively dispense soil through an exit. A two-tier strip conveyor assembly has a plurality of narrow conveyor belts coupled to a motor for translating the narrow conveyor belts in a first direction along a first plane below the exit of the hopper. The narrow conveyor belts spaced apart, defining one or more gaps. A plurality of support rails support and guide the narrow conveyor belts along the first plane and are configured to support and convey a container on the narrow conveyor belts in the first direction. The container receives a portion of the soil dispensed from the exit of the hopper, and the gaps pass a remaining portion of soil not received by the container to a second plane below the first plane. A catch conveyor belt along the second plane receives and translates the remaining portion of soil in a second direction along the second plane.

Abstract: A method for and a disassemblable prepackage arrangement for testing and burning-in an integrated circuit die which will be hermetically sealed within and form part of an overall integrated circuit package is herein disclosed. The die has a top and bottom surface and includes a plurality of die input/output terminals. The prepackage comprises a substrate including a top surface. The bottom of the die is disengagably attached to the top surface of the substrate. A lid is disengagably attached to the substrate in a way which hermetically seals the die within a space substantially defined by the substrate and the lid. Thereafter, the die input/output terminals are electrically connecting to external testing equipment for testing and burning-in the die while the die is in a hermetically sealed environment.