Patents by Inventor David W. Kierst

David W. Kierst has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of making a micro-electro-mechanical-systems (MEMS) device
    Patent number: 8455286
    Abstract: A method of forming a MEMS device includes forming a sacrificial layer over a substrate. The method further includes forming a metal layer over the sacrificial layer and forming a protection layer overlying the metal layer. The method further includes etching the protection layer and the metal layer to form a structure having a remaining portion of the protection layer formed over a remaining portion of the metal layer. The method further includes etching the sacrificial layer to form a movable portion of the MEMS device, wherein the remaining portion of the protection layer protects the remaining portion of the metal layer during the etching of the sacrificial layer to form the movable portion of the MEMS device.
    Type: Grant
    Filed: October 29, 2010
    Date of Patent: June 4, 2013
    Assignee: Freescale Semiconductor, Inc.
    Inventors: Lisa H. Karlin, David W. Kierst, Lianjun Liu, Wei Liu, Ruben B. Montez, Robert F. Steimle
  • METHOD OF MAKING A MICRO-ELECTRO-MECHANICAL-SYSTEMS (MEMS) DEVICE
    Publication number: 20120107993
    Abstract: A method of forming a MEMS device includes forming a sacrificial layer over a substrate. The method further includes forming a metal layer over the sacrificial layer and forming a protection layer overlying the metal layer. The method further includes etching the protection layer and the metal layer to form a structure having a remaining portion of the protection layer formed over a remaining portion of the metal layer. The method further includes etching the sacrificial layer to form a movable portion of the MEMS device, wherein the remaining portion of the protection layer protects the remaining portion of the metal layer during the etching of the sacrificial layer to form the movable portion of the MEMS device.
    Type: Application
    Filed: October 29, 2010
    Publication date: May 3, 2012
    Inventors: Lisa H. Karlin, David W. Kierst, Lianjun Liu, Wei Liu, Ruben Montez, Robert F. Steimle