Abstract: An integrated high brightness electrodeless lamp includes a lamp base defining two or more compartments housing components of the lamp, wherein at least one compartment provides an opening in the lamp base, a cover fitted to the lamp base, and an optics assembly positioned in the opening in the lamp base, wherein the lamp base, the cover, and the optics assembly provide an RF sealed system. The lamp components include an RF source providing RF energy for the lamp, an aperture bulb assembly including an electrodeless envelope containing a discharge forming fill which emits light when excited by RF energy, and an excitation structure for coupling RF energy from the RF source to the discharge forming fill. The optics assembly may be mounted in the opening in the lamp base with a twist lock mounting structure.

Abstract: A disposable solder receiving capsule for a hand held vacuum solder extracting desoldering tool is formed of an outer tube which is closed at one end by a porous filter and has an opening at its opposite end, and a hollow solder collection chamber part, having a tubular member with an open end and which is closed with respect to the passage of solder therethrough at an opposite end, forming a solder receiving space within it. The solder collection chamber part is concentrically positioned within the outer tube with an air plenum disposed between the closed end of the chamber part and the filter and with at least one air channel extending the length of solder collection part for providing a path for gases entering the open end of the outer tube to the plenum and the filter that is separated from the solder receiving space. For facilitating solder reclamation, the capsule can be formed entirely of materials which are shape-sustaining when exposed to a temperature of 400° F.

Abstract: A disposable solder receiving capsule for a hand held vacuum solder extracting desoldering tool is formed of an outer tube which is closed at one end by a porous filter and is open at its opposite end, and a hollow solder collection chamber part having a tubular member with an open end and a closed end forming a solder receiving space within it. The solder collection chamber part is concentrically positioned within the outer tube with an air plenum disposed between the closed end of the chamber part and the filter and with at least one air channel extending the length of solder collection part for providing a path for gases entering the open end of the outer tube to the plenum and the filter that is separated from said solder receiving space. For facilitating solder reclamation, the capsule can be formed entirely of materials which are shape-sustaining when exposed to a temperature of 400° F.