Abstract: A flex dot wafer probe having utility as an electrical interface between semiconductor wafers and electronic test systems for determining the electrical integrity and performance of integrated circuits. The wafer probe comprises a wafer probe head having a preformed resilient, bendable, formable film mounted on a support member for flexible movement. The wafer probe head is integrated with a probe board which interfaces with an external test system. Wafer contact pads and protrusions are formed on the film in "mirror-image" patterns corresponding to the contact elements of the integrated circuits and interface contact pads of the probe board, respectively. Coplanar line conductors, formed to control the characteristic impedance of the wafer probe head, provide electrical continuity between the wafer contact pads and the protrusions.

Abstract: A high density backplane (HDB) connector is provided for electrically interconnecting high density printed circuit boards. The printed circuit boards have a predetermined geometric conductive pattern which includes high density arrays of individual signal/power contact interconnects and unitary ground strips. The HDB connector comprises a housing module secured to one board and a stiffener module secured to a second board. A compliant contact module mounted within the housing module includes a resilient member, an insulator member having arrays of free-floating rigid contact pins disposed therein, and a flexile film interposed therebetween. The flexile film has a signal/power conductive matrix formed on one side and a continuous ground plane formed on the other side. The compliant contact module further includes prestressed early-mate ground contacts and a plurality of distributed resilient ground contacts. Circuit board mating is effected by pressing the stiffener module down onto the housing module.

Abstract: A unitary, molded card straightener is selectively mounted along the mouth of a card edge connector. The straightener funnels the card edge toward the mouth of the card edge connector and impinges against the side of the card prior to entry thereof into the connector, so that warpage in the card is flattened by the straightener.