Patents by Inventor David W. Porter

David W. Porter has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10954605
    Abstract: An apparatus for continuous simultaneous electroplating of two metals having substantially different standard electrodeposition potentials (e.g., for deposition of Sn—Ag alloys) comprises an anode chamber for containing an anolyte comprising ions of a first, less noble metal, (e.g., tin), but not of a second, more noble, metal (e.g., silver) and an active anode; a cathode chamber for containing catholyte including ions of a first metal (e.g., tin), ions of a second, more noble, metal (e.g., silver), and the substrate; a separation structure positioned between the anode chamber and the cathode chamber, where the separation structure substantially prevents transfer of more noble metal from catholyte to the anolyte; and fluidic features and an associated controller coupled to the apparatus and configured to perform continuous electroplating, while maintaining substantially constant concentrations of plating bath components for extended periods of use.
    Type: Grant
    Filed: September 5, 2018
    Date of Patent: March 23, 2021
    Assignee: Novellus Systems, Inc.
    Inventors: Lee Peng Chua, Steven T. Mayer, David W. Porter, Thomas A. Ponnuswamy
  • Patent number: 10920335
    Abstract: Methods of electroplating metal on a substrate while controlling azimuthal uniformity, include, in one aspect, providing the substrate to the electroplating apparatus configured for rotating the substrate during electroplating, and electroplating the metal on the substrate while rotating the substrate relative to a shield such that a selected portion of the substrate at a selected azimuthal position dwells in a shielded area for a different amount of time than a second portion of the substrate having the same average arc length and the same average radial position and residing at a different angular (azimuthal) position. The shield is positioned in close proximity of the substrate (e.g., within a distance that is equal to 0.1 of the substrate's radius). The shield in some embodiments may be an ionically resistive ionically permeable element having an azimuthally asymmetric distribution of channels.
    Type: Grant
    Filed: June 13, 2018
    Date of Patent: February 16, 2021
    Assignee: Novellus Systems, Inc.
    Inventors: Steven T. Mayer, David W. Porter, Bryan L. Buckalew, Robert Rash
  • Patent number: 10840101
    Abstract: Disclosed are pre-wetting apparatus designs and methods. These apparatus designs and methods are used to pre-wet a wafer prior to plating a metal on the surface of the wafer. Disclosed compositions of the pre-wetting fluid prevent corrosion of a seed layer on the wafer and also improve the filling rates of features on the wafer.
    Type: Grant
    Filed: November 20, 2017
    Date of Patent: November 17, 2020
    Assignee: Novellus Systems, Inc.
    Inventors: Steven T. Mayer, David W. Porter, Mark J. Willey
  • Patent number: 10662545
    Abstract: Methods and apparatus for electroplating material onto a substrate are provided. In many cases the material is metal and the substrate is a semiconductor wafer, though the embodiments are no so limited. Typically, the embodiments herein utilize a porous ionically resistive plate positioned near the substrate, the plate having a plurality of interconnecting 3D channels and creating a cross flow manifold defined on the bottom by the plate, on the top by the substrate, and on the sides by a cross flow confinement ring. During plating, fluid enters the cross flow manifold both upward through channels in the plate, and laterally through a cross flow side inlet positioned on one side of the cross flow confinement ring. The flow paths combine in the cross flow manifold and exit at the cross flow exit, which is positioned opposite the cross flow inlet. These combined flow paths result in improved plating uniformity.
    Type: Grant
    Filed: October 31, 2017
    Date of Patent: May 26, 2020
    Assignee: Novellus Systems, Inc.
    Inventors: Steven T. Mayer, Bryan L. Buckalew, Haiying Fu, Thomas Ponnuswamy, Hilton Diaz Camilo, Robert Rash, David W. Porter
  • Patent number: 10660239
    Abstract: A cooling system is provided which includes, for instance, a coolant circulation loop, one or more primary coolant pumps, and a fill and drain pump. The primary coolant pump(s) is coupled to facilitate circulating coolant through the coolant circulation loop, and the fill and drain pump facilitates selective filling of the cooling system with the coolant, or draining of the coolant from the cooling system. The fill and drain pump is integrated with the cooling system as a backup coolant pump to the primary coolant pump(s), and circulates the coolant through the coolant circulation loop responsive to an error in the primary coolant pump(s). The primary coolant pump(s) and fill and drain pumps may be different types of pumps, and the cooling system further includes a control system for automatically activating the fill and drain pump upon detection of an error in the primary coolant pump(s).
    Type: Grant
    Filed: November 28, 2017
    Date of Patent: May 19, 2020
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: David L. Edwards, Gary F. Goth, Daniel J. Kearney, Peter W. Kelly, Francis R. Krug, Jr., Robert K. Mullady, Donald W. Porter, Allan C. VanDeventer, Randy J. Zoodsma
  • Publication number: 20200118809
    Abstract: Methods are provided for conducting a deposition on a semiconductor substrate by selectively depositing a material on the substrate. The substrate has a plurality of substrate materials, each with a different nucleation delay corresponding to the material deposited thereon. Specifically, the nucleation delay associated with a first substrate material on which deposition is intended is less than the nucleation delay associated with a second substrate material on which deposition is not intended according to a nucleation delay differential, which degrades as deposition proceeds. A portion of the deposited material is etched to reestablish the nucleation delay differential between the first and the second substrate materials. The material is further selectively deposited on the substrate.
    Type: Application
    Filed: December 13, 2019
    Publication date: April 16, 2020
    Inventors: Kapu Sirish Reddy, Meliha Gozde Rainville, Nagraj Shankar, Dennis M. Hausmann, David Charles Smith, Karthik Sivaramakrishnan, David W. Porter
  • Patent number: 10559461
    Abstract: Methods are provided for conducting a deposition on a semiconductor substrate by selectively depositing a material on the substrate. The substrate has a plurality of substrate materials, each with a different nucleation delay corresponding to the material deposited thereon. Specifically, the nucleation delay associated with a first substrate material on which deposition is intended is less than the nucleation delay associated with a second substrate material on which deposition is not intended according to a nucleation delay differential, which degrades as deposition proceeds. A portion of the deposited material is etched to reestablish the nucleation delay differential between the first and the second substrate materials. The material is further selectively deposited on the substrate.
    Type: Grant
    Filed: April 28, 2017
    Date of Patent: February 11, 2020
    Assignee: LAM RESEARCH CORPORATION
    Inventors: Kapu Sirish Reddy, Meliha Gozde Rainville, Nagraj Shankar, Dennis M. Hausmann, David Charles Smith, Karthik Sivaramakrishnan, David W. Porter
  • Patent number: 10508359
    Abstract: The embodiments herein relate to methods and apparatus for determining whether a particular test bath is able to successfully fill a feature on a substrate. In various cases, the substrate is a semiconductor substrate and the feature is a through-silicon-via. Generally, two experiments are used: a first experiment simulates the conditions present in a field region of the substrate during the fill process, and the second experiment simulates the conditions present in a feature on the substrate during the fill process. The output from these experiments may be used with various techniques to predict whether the particular bath will result in an adequately filled feature.
    Type: Grant
    Filed: May 9, 2017
    Date of Patent: December 17, 2019
    Assignee: Lam Research Corporation
    Inventors: Lee Brogan, Steven T. Mayer, Matthew Thorum, Joseph Richardson, David W. Porter, Haiying Fu
  • Publication number: 20190351625
    Abstract: A fusion machine which can be top-loaded on very large polyolefin pipes and pipelines has jaws which consist of an upper half jaw and lower left and right complemental jaws which pivot on the half jaw. Left and right actuators connected between the complemental jaws and the half jaw operate in one direction to cause the complemental jaws to rotate to an opened condition in which the upper half jaw can be lowered onto and lifted from the pipes to be fused and in the other direction to cause the complemental jaws to rotate to a closed condition in which the pipes to be fused are gripped so substantially around their circumferences as to resist their deformation from round during manipulation by the machine. The top-loading machine minimizes the need for heavy equipment to load and unload pipe to and from the fusion machine.
    Type: Application
    Filed: August 2, 2019
    Publication date: November 21, 2019
    Applicant: McElroy Manufacturing, Inc.
    Inventors: Jason A. Lawrence, James R. Perrault, David W. Porter, Timothy M. Thoman, Bobby Lee Murray
  • Patent number: 10369751
    Abstract: A fusion machine which can be top-loaded on very large polyolefin pipes and pipelines has jaws which consist of an upper half jaw and lower left and right complemental jaws which pivot on the half jaw. Left and right actuators connected between the complemental jaws and the half jaw operate in one direction to cause the complemental jaws to rotate to an opened condition in which the upper half jaw can be lowered onto and lifted from the pipes to be fused and in the other direction to cause the complemental jaws to rotate to a closed condition in which the pipes to be fused are gripped so substantially around their circumferences as to resist their deformation from round during manipulation by the machine. The top-loading machine minimizes the need for heavy equipment to load and unload pipe to and from the fusion machine.
    Type: Grant
    Filed: January 25, 2016
    Date of Patent: August 6, 2019
    Assignee: McElroy Manufacturing, Inc.
    Inventors: Jason A. Lawrence, James R. Perrault, David W. Porter, Timothy M. Thoman, Bobby Lee Murray
  • Patent number: 10309024
    Abstract: An apparatus for continuous simultaneous electroplating of two metals having substantially different standard electrodeposition potentials (e.g., for deposition of Sn—Ag alloys) comprises an anode chamber for containing an anolyte comprising ions of a first, less noble metal, (e.g., tin), but not of a second, more noble, metal (e.g., silver) and an active anode; a cathode chamber for containing catholyte including ions of a first metal (e.g., tin), ions of a second, more noble, metal (e.g., silver), and the substrate; a separation structure positioned between the anode chamber and the cathode chamber, where the separation structure substantially prevents transfer of more noble metal from catholyte to the anolyte; and fluidic features and an associated controller coupled to the apparatus and configured to perform continuous electroplating, while maintaining substantially constant concentrations of plating bath components for extended periods of use.
    Type: Grant
    Filed: April 20, 2018
    Date of Patent: June 4, 2019
    Assignee: Novellus Systems, Inc.
    Inventors: Steven T. Mayer, David W. Porter
  • Publication number: 20190057778
    Abstract: A method for characterizing and locating abnormal tissue in an area of interest in a body is provided. The method may include receiving first and second modality examination data including a plurality of first and second modality examination data segments of the area of interest and determining, by evaluating each first and second modality examination data segment, a set of modality detection candidates based on the first and second modality examination data and a first and second modality feature likelihood model.
    Type: Application
    Filed: August 16, 2018
    Publication date: February 21, 2019
    Inventors: David W. Porter, William C. Walton, Keith S. Peyton, Susan C. Harvey, Benjamin MW Tsui
  • Patent number: 10208395
    Abstract: The embodiments disclosed herein relate to methods and apparatus for promoting bubble-free circulation of processing fluids in a recirculation system. Certain disclosed techniques involve passive, mechanical valve designs that promote variable resistance to flow in a drain. Other techniques involve automated flow control schemes that utilize feedback from flow meters, level sensors, etc. to achieve a balanced and bubble-free flow. The disclosed embodiments greatly reduce the incorporation of gas into a processing fluid, in particular as the processing fluid returns from a processing cell to a reservoir.
    Type: Grant
    Filed: February 24, 2017
    Date of Patent: February 19, 2019
    Assignee: Lam Research Corporation
    Inventors: Richard Abraham, Robert Rash, David W. Porter, Steven T. Mayer, John Ostrowski
  • Publication number: 20180371637
    Abstract: An apparatus for continuous simultaneous electroplating of two metals having substantially different standard electrodeposition potentials (e.g., for deposition of Sn—Ag alloys) comprises an anode chamber for containing an anolyte comprising ions of a first, less noble metal, (e.g., tin), but not of a second, more noble, metal (e.g., silver) and an active anode; a cathode chamber for containing catholyte including ions of a first metal (e.g., tin), ions of a second, more noble, metal (e.g., silver), and the substrate; a separation structure positioned between the anode chamber and the cathode chamber, where the separation structure substantially prevents transfer of more noble metal from catholyte to the anolyte; and fluidic features and an associated controller coupled to the apparatus and configured to perform continuous electroplating, while maintaining substantially constant concentrations of plating bath components for extended periods of use.
    Type: Application
    Filed: September 5, 2018
    Publication date: December 27, 2018
    Inventors: Lee Peng Chua, Steven T. Mayer, David W. Porter, Thomas A. Ponnuswamy
  • Publication number: 20180350670
    Abstract: Method and apparatus for reducing metal oxide surfaces to modified metal surfaces and cooling the metal surfaces are disclosed. By exposing a metal oxide surface to remote plasma, the metal oxide surface on a substrate can be reduced to pure metal. A remote plasma apparatus can treat the metal oxide surface as well as actively cool, load/unload, and move the substrate within a single standalone apparatus. The remote plasma apparatus can be configured to actively cool the substrate during and/or after reducing the metal oxide to pure metal using an active cooling system. The active cooling system can include one or more of an actively cooled pedestal, an actively cooled showerhead, and one or more cooling gas inlets for delivering cooling gas to cool the substrate.
    Type: Application
    Filed: November 30, 2017
    Publication date: December 6, 2018
    Inventors: Tighe A. Spurlin, George Andrew Antonelli, Natalia V. Doubina, James E. Duncan, Jonathan David Reid, David W. Porter
  • Publication number: 20180308680
    Abstract: Methods are provided for conducting a deposition on a semiconductor substrate by selectively depositing a material on the substrate. The substrate has a plurality of substrate materials, each with a different nucleation delay corresponding to the material deposited thereon. Specifically, the nucleation delay associated with a first substrate material on which deposition is intended is less than the nucleation delay associated with a second substrate material on which deposition is not intended according to a nucleation delay differential, which degrades as deposition proceeds. A portion of the deposited material is etched to reestablish the nucleation delay differential between the first and the second substrate materials. The material is further selectively deposited on the substrate.
    Type: Application
    Filed: April 28, 2017
    Publication date: October 25, 2018
    Inventors: Kapu Sirish Reddy, Meliha Gozde Rainville, Nagraj Shankar, Dennis M. Hausmann, David Charles Smith, Karthik Sivaramakrishnan, David W. Porter
  • Patent number: 10106907
    Abstract: An apparatus for continuous simultaneous electroplating of two metals having substantially different standard electrodeposition potentials (e.g., for deposition of Sn—Ag alloys) comprises an anode chamber for containing an anolyte comprising ions of a first, less noble metal, (e.g., tin), but not of a second, more noble, metal (e.g., silver) and an active anode; a cathode chamber for containing catholyte including ions of a first metal (e.g., tin), ions of a second, more noble, metal (e.g., silver), and the substrate; a separation structure positioned between the anode chamber and the cathode chamber, where the separation structure substantially prevents transfer of more noble metal from catholyte to the anolyte; and fluidic features and an associated controller coupled to the apparatus and configured to perform continuous electroplating, while maintaining substantially constant concentrations of plating bath components for extended periods of use.
    Type: Grant
    Filed: November 23, 2016
    Date of Patent: October 23, 2018
    Assignee: Novellus Systems, Inc.
    Inventors: Lee Peng Chua, Steven T. Mayer, David W. Porter, Thomas A. Ponnuswamy
  • Publication number: 20180291517
    Abstract: Methods of electroplating metal on a substrate while controlling azimuthal uniformity, include, in one aspect, providing the substrate to the electroplating apparatus configured for rotating the substrate during electroplating, and electroplating the metal on the substrate while rotating the substrate relative to a shield such that a selected portion of the substrate at a selected azimuthal position dwells in a shielded area for a different amount of time than a second portion of the substrate having the same average arc length and the same average radial position and residing at a different angular (azimuthal) position. The shield is positioned in close proximity of the substrate (e.g., within a distance that is equal to 0.1 of the substrate's radius). The shield in some embodiments may be an ionically resistive ionically permeable element having an azimuthally asymmetric distribution of channels.
    Type: Application
    Filed: June 13, 2018
    Publication date: October 11, 2018
    Inventors: Steven T. Mayer, David W. Porter, Bryan L. Buckalew, Robert Rash
  • Publication number: 20180237933
    Abstract: An apparatus for continuous simultaneous electroplating of two metals having substantially different standard electrodeposition potentials (e.g., for deposition of Sn—Ag alloys) comprises an anode chamber for containing an anolyte comprising ions of a first, less noble metal, (e.g., tin), but not of a second, more noble, metal (e.g., silver) and an active anode; a cathode chamber for containing catholyte including ions of a first metal (e.g., tin), ions of a second, more noble, metal (e.g., silver), and the substrate; a separation structure positioned between the anode chamber and the cathode chamber, where the separation structure substantially prevents transfer of more noble metal from catholyte to the anolyte; and fluidic features and an associated controller coupled to the apparatus and configured to perform continuous electroplating, while maintaining substantially constant concentrations of plating bath components for extended periods of use.
    Type: Application
    Filed: April 20, 2018
    Publication date: August 23, 2018
    Inventors: Steven T. Mayer, David W. Porter
  • Patent number: 10023970
    Abstract: Methods, systems, and apparatus for plating a metal onto a work piece are described. In one aspect, an apparatus includes a plating chamber, a substrate holder, an anode chamber housing an anode, an ionically resistive ionically permeable element positioned between a substrate and the anode chamber during electroplating, an auxiliary cathode located between the anode and the ionically resistive ionically permeable element, and an insulating shield with an opening in its central region. The insulating shield may be movable with respect to the ionically resistive ionically permeable element to vary a distance between the shield and the ionically resistive ionically permeable element during electroplating.
    Type: Grant
    Filed: October 18, 2017
    Date of Patent: July 17, 2018
    Assignee: Novellus Systems, Inc.
    Inventors: Zhian He, David W. Porter, Jonathan D. Reid, Frederick D. Wilmot