Patents by Inventor David W. Simmen

David W. Simmen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9568499
    Abstract: A zero insertion force (ZIF) connector can include a connector housing defining an opening and an interior space for receiving a mating member, multiple LIGA springs positioned within the interior space and configured to apply pressure to the mating member while in a first position, and a locking component to cause the LIGA springs to move to a second position responsive to a user pressing the locking component. The LIGA springs do not apply pressure to the mating member while in the second position.
    Type: Grant
    Filed: November 22, 2013
    Date of Patent: February 14, 2017
    Assignee: TEKTRONIX, INC.
    Inventors: James H. McGrath, Jr., Ira Pollock, David W. Simmen
  • Patent number: 9142903
    Abstract: A multiport zero insertion force (ZIF) connector can include a multiport connector housing defining an opening and an interior space for receiving a multi-path circuit device having multiple types of electrical connection paths therethrough and multiple LIGA springs positioned within the interior space to apply pressure to the multi-path circuit device while in a first position. A locking component can be configured to cause the LIGA springs to move to a second position responsive to a user pressing the locking component, wherein the LIGA springs do not apply pressure to the multi-path circuit device while in the second position.
    Type: Grant
    Filed: November 22, 2013
    Date of Patent: September 22, 2015
    Assignee: TEKTRONIX, INC.
    Inventors: James H. McGrath, Jr., Ira Pollock, David W. Simmen
  • Publication number: 20150147922
    Abstract: A multiport zero insertion force (ZIF) connector can include a multiport connector housing defining an opening and an interior space for receiving a multi-path circuit device having multiple types of electrical connection paths therethrough and multiple LIGA springs positioned within the interior space to apply pressure to the multi-path circuit device while in a first position. A locking component can be configured to cause the LIGA springs to move to a second position responsive to a user pressing the locking component, wherein the LIGA springs do not apply pressure to the multi-path circuit device while in the second position.
    Type: Application
    Filed: November 22, 2013
    Publication date: May 28, 2015
    Applicant: Tektronix, Inc.
    Inventors: James H. McGrath, JR., Ira Pollock, David W. Simmen
  • Publication number: 20150145545
    Abstract: A zero insertion force (ZIF) connector can include a connector housing defining an opening and an interior space for receiving a mating member, multiple LIGA springs positioned within the interior space and configured to apply pressure to the mating member while in a first position, and a locking component to cause the LIGA springs to move to a second position responsive to a user pressing the locking component. The LIGA springs do not apply pressure to the mating member while in the second position.
    Type: Application
    Filed: November 22, 2013
    Publication date: May 28, 2015
    Applicant: Tektronix, Inc.
    Inventors: James H. McGrath, JR., Ira Pollock, David W. Simmen
  • Patent number: 6459287
    Abstract: An attachable/detachable probe point for use with an electrical measurement probe includes a base having a aperture formed therein that extends through the base. An electrically conductive probing contact having at least a partially threaded body member and a pointed contact member is disposed in the aperture with a portion of the body member extending from the top surface of the base and the pointed contact member extendable from a first position within the aperture to a second protruding position outside the aperture at the bottom surface of the base. A compliant adhesive material formed on the bottom surface of the base for securing the attachable/detachable probe point to probing contact point.
    Type: Grant
    Filed: May 18, 2001
    Date of Patent: October 1, 2002
    Assignee: Tektronix, Inc.
    Inventors: Mark W. Nightingale, David W. Simmen, Phillip D. Applebee, R. Kenneth Price