Patents by Inventor David W. Zimmerman

David W. Zimmerman has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10450645
    Abstract: A coating system for coating a part (10), such as a turbine blade or vane, has a mask (14) positioned adjacent to a first portion (16) of the part (10) to be coated and a mechanism (30) for moving the mask (14) relative to the part (10). The mechanism (30) may be a gear mechanism or a magnetic mechanism.
    Type: Grant
    Filed: September 22, 2017
    Date of Patent: October 22, 2019
    Assignee: United Technologies Corporation
    Inventors: James W. Neal, David A. Litton, Russell A. Beers, Benjamin Joseph Zimmerman, Michael J. Maloney
  • Patent number: 10446373
    Abstract: In an embodiment of the invention there is a cyclotronic actuator utilizing a high-voltage plasma driver connected to a first electrode. A second electrode is grounded and the two are isolated from each other by a dielectric plate. A magnet is positioned beneath the dielectric plate such that a coaxial dielectric barrier discharge plasma is formed outwardly between the first electrode across the dielectric plate. The magnet positioned beneath the dielectric plate introduces a magnetic field transverse to the plasma current path, such that the plasma discharge discharges radially and the local magnetic field is oriented vertically in a direction perpendicular to the dielectric plate to create a Lorentz Force, which forces the plasma discharge to move radially outwardly in a curved radial streamer mode pattern.
    Type: Grant
    Filed: April 18, 2019
    Date of Patent: October 15, 2019
    Assignee: CU Aerospace, LLC
    Inventors: Joseph W. Zimmerman, David L. Carroll, Phillip J. Ansell, Georgi Hristov
  • Publication number: 20190246482
    Abstract: In an embodiment of the invention there is a cyclotronic actuator utilizing a high-voltage plasma driver connected to a first electrode. A second electrode is grounded and the two are isolated from each other by a dielectric plate. A magnet is positioned beneath the dielectric plate such that a coaxial dielectric barrier discharge plasma is formed outwardly between the first electrode across the dielectric plate. The magnet positioned beneath the dielectric plate introduces a magnetic field transverse to the plasma current path, such that the plasma discharge discharges radially and the local magnetic field is oriented vertically in a direction perpendicular to the dielectric plate to create a Lorentz Force, which forces the plasma discharge to move radially outwardly in a curved radial streamer mode pattern.
    Type: Application
    Filed: April 18, 2019
    Publication date: August 8, 2019
    Applicants: CU Aerospace, LLC, The Board of Trustees of the University of Illinois
    Inventors: Joseph W. Zimmerman, David L. Carroll, Phillip J. Ansell, Georgi Hristov
  • Patent number: 10332724
    Abstract: In an embodiment of the invention there is a cyclotronic actuator. The actuator is defined by having a high-voltage plasma driver connected to a first electrode. The first electrode is surrounded by a dielectric material. A second electrode is grounded and placed away from the first electrode, such that a plasma arc is formed between the pair of electrodes when the high-voltage plasma driver is activated. A ring magnet surrounding the second electrode is configured to introduce a magnetic field locally to the plasma arc. The plasma arc will then discharge in a radial direction. The magnet creates a local magnetic field oriented vertically in a direction parallel to the axisymmetric orientation of the first and second electrodes to create a Lorentz Force. The force causes the plasma arc to move in a tangential direction and causes the plasma arc to discharge out in a circular pattern.
    Type: Grant
    Filed: March 16, 2018
    Date of Patent: June 25, 2019
    Assignee: CU Aerospace, LLC
    Inventors: Joseph W. Zimmerman, David L. Carroll, Phillip J. Ansell, Georgi Hristov
  • Publication number: 20190089042
    Abstract: An illustrative example transmission device, which is useful for an automated vehicle, includes a substrate having a metal layer near one surface of the substrate and a waveguide area. The metal layer includes a slot that at least partially overlaps the waveguide area. A source of radiation includes a first radiation output situated on a first side of the slot and a second radiation output situated on a second, opposite side of the slot.
    Type: Application
    Filed: September 20, 2017
    Publication date: March 21, 2019
    Inventors: George J. Purden, Shawn Shi, David W. Zimmerman
  • Patent number: 10199707
    Abstract: A ball-grid-array printed-circuit-board assembly includes a die, a plurality of solder-balls, a substrate, a top-metal layer, and a bottom-metal layer. The die includes a signal-out-pad and a plurality of ground-pads arranged about the signal-out-pad. The top-metal layer, a plurality of vias in the substrate, and the bottom-metal layer cooperate to form a substrate-integrated-waveguide. The top-metal layer is configured to define a U-shaped-slot between a signal-portion of the top-metal layer aligned with the signal-out-pad and the substrate-integrated-waveguide, and a ground-portion of the top-metal layer aligned with the plurality of ground-pads. The U-shaped-slot is characterized by a slot-length that is selected based on the frequency of a signal, and a slot-width that is selected based on the via-height such that the signal generates an electric field directed across the U-shaped-slot whereby the signal is propagated from the signal-portion of the top-metal layer into the substrate-integrated-waveguide.
    Type: Grant
    Filed: October 13, 2016
    Date of Patent: February 5, 2019
    Assignee: APTIV TECHNOLOGIES LIMITED
    Inventors: George J. Purden, Shawn Shi, David W. Zimmerman
  • Patent number: 9978707
    Abstract: A circuit-board-assembly includes a printed-circuit-board, an integrated-circuit-die, a ball-grid-array, a barrier-material, and an adhesive-material. The printed-circuit-board includes a mounting-surface that defines a plurality of contact-pads and a continuous-trace that interconnects a selected-group of the contact-pads. The integrated-circuit-die includes an electrical-circuit having a plurality of solder-pads. The ball-grid-array includes a plurality of solder-balls interposed between the contact-pads and the solder-pads. The plurality of solder-balls establish electrical communication between the electrical-circuit and the contact-pads. The barrier-material is located between a string of solder-balls that are attached to the selected-group of the contact-pads to create a barrier. The barrier segregates an underfill-region from a non-underfill-region between the printed-circuit-board and the integrated-circuit-die.
    Type: Grant
    Filed: March 23, 2017
    Date of Patent: May 22, 2018
    Assignee: DELPHI TECHNOLOGIES, INC.
    Inventors: David W. Zimmerman, Michael J. Pepples, David W. Ihms
  • Publication number: 20180108968
    Abstract: A ball-grid-array printed-circuit-board assembly includes a die, a plurality of solder-balls, a substrate, a top-metal layer, and a bottom-metal layer. The die includes a signal-out-pad and a plurality of ground-pads arranged about the signal-out-pad. The top-metal layer, a plurality of vias in the substrate, and the bottom-metal layer cooperate to form a substrate-integrated-waveguide. The top-metal layer is configured to define a U-shaped-slot between a signal-portion of the top-metal layer aligned with the signal-out-pad and the substrate-integrated-waveguide, and a ground-portion of the top-metal layer aligned with the plurality of ground-pads. The U-shaped-slot is characterized by a slot-length that is selected based on the frequency of a signal, and a slot-width that is selected based on the via-height such that the signal generates an electric field directed across the U-shaped-slot whereby the signal is propagated from the signal-portion of the top-metal layer into the substrate-integrated-waveguide.
    Type: Application
    Filed: October 13, 2016
    Publication date: April 19, 2018
    Inventors: George J. Purden, Shawn Shi, David W. Zimmerman
  • Publication number: 20160197400
    Abstract: A circuit board assembly includes a low-frequency (LF) substrate, a monolithic microwave integrated circuit (MMIC), electrical components, a high-frequency (HF) substrate, and an antenna. The LF substrate is formed of FR-4 type material. The LF substrate defines a waveguide through the LF substrate. The MMIC is attached to the top-side of the LF substrate and outputs the radio-frequency signal. The electrical components are electrically attached to the LF substrate. The HF substrate is soldered to the top side of the LF substrate. An opening through the HF substrate surrounds the MMIC. A vertical transition guides the radio-frequency signal output by the MMIC to the waveguide. A plurality of wire bonds electrically connects the MMIC to the HF substrate and couple the radio-frequency signal from the MMIC to the vertical transition. The antenna is attached to the LF substrate and configured to radiate the radio-frequency signal from the waveguide.
    Type: Application
    Filed: January 7, 2015
    Publication date: July 7, 2016
    Inventors: DAVID W. ZIMMERMAN, JAMES F. SEARCY, CHARLES I. DELHEIMER
  • Patent number: 8680936
    Abstract: A surface mountable transition block for perpendicular transitions between a microstrip or stripline and a waveguide. The transition block configuration allows for a reduction in the overall cost of a microwave circuit assembly because the circuit board to which the transition block is attached can be an FR-4 type circuit board as opposed to more expensive microwave circuit board materials.
    Type: Grant
    Filed: November 18, 2011
    Date of Patent: March 25, 2014
    Assignee: Delphi Technologies, Inc.
    Inventors: George J. Purden, David W. Zimmerman
  • Publication number: 20130127562
    Abstract: A surface mountable transition block for perpendicular transitions between a microstrip or stripline and a waveguide. The transition block configuration allows for a reduction in the overall cost of a microwave circuit assembly because the circuit board to which the transition block is attached can be an FR-4 type circuit board as opposed to more expensive microwave circuit board materials.
    Type: Application
    Filed: November 18, 2011
    Publication date: May 23, 2013
    Applicant: DELPHI TECHNOLOGIES, INC.
    Inventors: GEORGE J. PURDEN, DAVID W. ZIMMERMAN
  • Publication number: 20120013742
    Abstract: A vision system in a vehicle and a method for operating the system. The system displays a field of view that is a portion of an image of an area proximate to the vehicle. The system includes an object detection means that provides an indication of an object being present in the area proximate to the vehicle. The field of view is selected at least in part based on the detection of the object, such as directing the field of view toward the object so the vehicle driver can more easily discern the presence of the object in a display.
    Type: Application
    Filed: July 16, 2010
    Publication date: January 19, 2012
    Applicant: DELPHI TECHNOLOGIES, INC.
    Inventors: Manuel R. Fairchild, David W. Zimmerman, Michael E. Miller
  • Patent number: 7855685
    Abstract: A microwave communication package is constructed on an electrically conducting base plate having a first side defining a base plate cavity, with an antenna apparatus mounted on an opposite, second side. A dielectric substrate on the first side of the base plate covers the base plate cavity; and sealing apparatus contacting the dielectric substrate and the base plate completely around the base plate cavity hermetically seals the cavity. Circuitry mounted on a surface of the substrate within the base plate cavity includes one or more microstrip lines communicating components to one or more waveguides comprising openings extending through the base plate; and the waveguides are coupled at their opposite ends to the antenna apparatus.
    Type: Grant
    Filed: September 28, 2007
    Date of Patent: December 21, 2010
    Assignee: Delphi Technologies, Inc.
    Inventors: Matthew R. Walsh, Deepukumar M. Nair, David W. Zimmerman, Benjamen E. Haffke, Scott D. Brandenburg, Charles I. Delheimer, Michael E. Miller, Bruce Wayne Butler
  • Publication number: 20090179726
    Abstract: An inductor and method of containing a magnetic field is provided. The inductor includes a first set of layers wound in a first predetermined direction, wherein each layer of the first set of layers is electrically connected to one another, and a second set of layers wound in a second predetermined direction, wherein each layer of the second set of layers is electrically connected to one another and the first set of layers, and the second set of layers is between a top layer and a bottom layer, such that the top layer forms a first pair with a first layer of the second set of layers, and the bottom layer forms a second pair with a second layer of the second set of layers so that the magnetic field is substantially contained, such as to remain substantially within a gap defined between each layer of the pairs of layers.
    Type: Application
    Filed: January 10, 2008
    Publication date: July 16, 2009
    Inventors: Carl W. Berlin, David W. Zimmerman, Aleksandra Djordjevic
  • Publication number: 20090085808
    Abstract: A microwave communication package is constructed on an electrically conducting base plate having a first side defining a base plate cavity, with an antenna apparatus mounted on an opposite, second side. A dielectric substrate on the first side of the base plate covers the base plate cavity; and sealing apparatus contacting the dielectric substrate and the base plate completely around the base plate cavity hermetically seals the cavity. Circuitry mounted on a surface of the substrate within the base plate cavity includes one or more microstrip lines communicating components to one or more waveguides comprising openings extending through the base plate; and the waveguides are coupled at their opposite ends to the antenna apparatus.
    Type: Application
    Filed: September 28, 2007
    Publication date: April 2, 2009
    Inventors: Matthew R. Walsh, Deepukumar M. Nair, David W. Zimmerman, Benjamen E. Haffke, Scott D. Brandenburg, Charles I. Delheimer, Michael E. Miller, Bruce Wayne Butler
  • Patent number: 7440282
    Abstract: An electronic package is provided for dissipating heat away from electronic devices. The package includes a substrate and electronic devices mounted on the substrate. The package also has a thermally conductive heat sink assembled over the electronic device. The heat sink includes compliant pedestals each having a contact surface for contacting a surface of an electronic device to conduct thermal energy away from the electronic device. The package is held together such that the heat sink is in contact with the surface of an electronic device such that each compliant pedestal applies a compressive force to the surface of the electronic device.
    Type: Grant
    Filed: May 16, 2006
    Date of Patent: October 21, 2008
    Assignee: Delphi Technologies, Inc.
    Inventors: Scott D. Brandenburg, Suresh K. Chengalva, David W. Zimmerman
  • Publication number: 20080142911
    Abstract: A high-frequency Electromagnetic Bandgap (EBG) motion sensor device, and a method for making such a device are provided. The device includes a substantially planar substrate including multiple conducting vias forming a periodic lattice in the substrate. The vias extend from the lower surface of the substrate to the upper surface of the substrate. The device also includes a movable defect positioned in the periodic lattice. The movable defect is configured to move relative to the plurality of vias. A resonant frequency of the Electromagnetic Bandgap (EBG) motion sensor device varies based on movement of the movable defect.
    Type: Application
    Filed: December 14, 2006
    Publication date: June 19, 2008
    Inventors: Carl W. Berlin, Deepukumar M. Nair, David W. Zimmerman, Dwadasi H.R. Sarma
  • Patent number: 7365273
    Abstract: A circuit board assembly having a laminate construction of multiple layers, such as a LTCC ceramic substrate, with conductor lines between adjacent pairs of layers. A heat sink is bonded to a first surface of the substrate, and a cavity is defined by and between the heat sink and the substrate such that a base wall of the cavity is defined by one of the layers with conductor lines thereof being present on the base wall. A surface-mount circuit device is received within the cavity, mounted to the base wall, and electrically connected to the conductor lines on the base wall. The device is received within the cavity such that a surface of the device contacts a surface region of the heat sink. The surface of the device is bonded to the surface region of the heat sink to provide a substantially direct thermal path from the device to the heat sink.
    Type: Grant
    Filed: December 3, 2004
    Date of Patent: April 29, 2008
    Assignee: Delphi Technologies, Inc.
    Inventors: Manuel R. Fairchild, David W. Zimmerman, Suresh K. Chengalva
  • Patent number: 7352585
    Abstract: An electronic package having enhanced heat dissipation is provided exhibiting dual conductive heat paths in opposing directions. The package includes a substrate having electrical conductors thereon and a flip chip mounted to the substrate. The flip chip has a first surface, solder bumps on the first surface, and a second surface oppositely disposed from the first surface. The flip chip is mounted to the substrate such that the solder bumps are registered with the conductors on the substrate. The package further includes a stamped metal heat sink in heat transfer relationship with the second surface of the flip chip. The heat sink includes a cavity formed adjacent to the flip chip containing a thermally conductive material.
    Type: Grant
    Filed: October 19, 2006
    Date of Patent: April 1, 2008
    Assignee: Delphi Technologies, Inc.
    Inventors: Larry M Mandel, Kevin M. Gertiser, Suresh K. Chengalva, Dwadasi H. Sarma, David W. Zimmerman
  • Publication number: 20070268671
    Abstract: An electronic package is provided for dissipating heat away from electronic devices. The package includes a substrate and electronic devices mounted on the substrate. The package also has a thermally conductive heat sink assembled over the electronic device. The heat sink includes compliant pedestals each having a contact surface for contacting a surface of an electronic device to conduct thermal energy away from the electronic device. The package is held together such that the heat sink is in contact with the surface of an electronic device such that each compliant pedestal applies a compressive force to the surface of the electronic device.
    Type: Application
    Filed: May 16, 2006
    Publication date: November 22, 2007
    Inventors: Scott D. Brandenburg, Suresh K. Chengalva, David W. Zimmerman