Patents by Inventor David Wayne George

David Wayne George has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11969945
    Abstract: In one example in accordance with the present disclosure, a system is described. The system includes a reader to 1) read an identifier from a three-dimensional (3D) System printed object that includes a storage element and 2) read a location of the 3D printed object within a build material bed. An extractor of the system extracts, based on the identifier, a post processing operation to execute on the 3D printed object. A controller of the system controls a post processing operation based on extracted post processing operation information and the location.
    Type: Grant
    Filed: June 18, 2019
    Date of Patent: April 30, 2024
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Kristopher J. Erickson, Jarrid Wittkopf, Rafael Ballagas, David Wayne George, Lihua Zhao, William J. Allen
  • Patent number: 11887177
    Abstract: In one example in accordance with the present disclosure, a system is described. The system includes a reader to read an identifier associated with a part. An extractor of the system extracts, based on the identifier, sensor output data for the part. A transmitter of the system transmits a re-order request for the part based on the sensor output data.
    Type: Grant
    Filed: June 18, 2019
    Date of Patent: January 30, 2024
    Assignee: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
    Inventors: Kristopher J. Erickson, Jarrid Wittkopf, Rafael Ballagas, David Wayne George, Lihua Zhao, William J. Allen
  • Publication number: 20230395549
    Abstract: In one example in accordance with the present disclosure, an integrated circuit device is described. The integrated circuit device includes an integrated circuit die that includes a first surface and a second surface. A first electrical contact is disposed on the first surface of the integrated circuit die and a second electrical contact is disposed on the second surface of the integrated circuit die.
    Type: Application
    Filed: October 19, 2020
    Publication date: December 7, 2023
    Inventors: DAVID WAYNE GEORGE, KRISTOPHER J. ERICKSON, JARRID WITTKOPF
  • Publication number: 20220138374
    Abstract: In one example in accordance with the present disclosure, a system is described. The system includes a reader to read an identifier associated with a part. An extractor of the system extracts, based on the identifier, a design file for the part. A modifier of the system receives user input modifying the design file and a transmitter transmits the modified design file for production of the part.
    Type: Application
    Filed: June 18, 2019
    Publication date: May 5, 2022
    Applicant: Hewlett-Packard Development Company, L.P.
    Inventors: Kristopher J. Erickson, Jarrid Wittkopf, Rafael Ballagas, David Wayne George, Lihua Zhao, William J. Allen
  • Publication number: 20220118707
    Abstract: In one example in accordance with the present disclosure, a system is described. The system includes a scanner to read three-dimensional (3D) print information from a storage element to be embedded in a 3D printed object. The system also includes a controller. The controller 1) instructs an additive manufacturing device to form the 3D printed object based on the 3D print information stored in the storage element and 2) embeds the storage element into the 3D printed object.
    Type: Application
    Filed: June 18, 2019
    Publication date: April 21, 2022
    Applicant: Hewlett-Packard Development Company, L.P.
    Inventors: Kristopher J. Erickson, Jarrid Wittkopf, Rafael Ballagas, David Wayne George, Lihua Zhao, William J. Allen
  • Publication number: 20220097307
    Abstract: In one example in accordance with the present disclosure, an additive manufacturing system is described. The additive manufacturing system includes an additive manufacturing device to form a three-dimensional (3D) printed object. A placement device of the additive manufacturing system is to embed a sensing system into build material used to form the 3D printed object. The sensing system is to measure a manufacturing condition during formation of the 3D printed object. The additive manufacturing system also includes a controller to associate manufacturing condition with the 3D printed object.
    Type: Application
    Filed: June 18, 2019
    Publication date: March 31, 2022
    Applicant: Hewlett-Packard Development Company, L.P.
    Inventors: Kristopher J. Erickson, Jarrid Wittkopf, Rafael Ballagas, David Wayne George, Lihua Zhao, William J. Allen
  • Publication number: 20220097308
    Abstract: In one example in accordance with the present disclosure, an additive manufacturing system is described. The additive manufacturing system includes an additive manufacturing device to form a three-dimensional (3D) printed object. A placement device is to embed a storage element into the 3D printed object and a controller is to write data to the embedded storage element that relates to manufacturing conditions of the 3D printed object.
    Type: Application
    Filed: June 18, 2019
    Publication date: March 31, 2022
    Applicant: Hewlett-Packard Development Company, L.P.
    Inventors: Kristopher J. Erickson, Jarrid Wittkopf, Rafael Ballagas, David Wayne George, Lihua Zhao, William J. Allen
  • Publication number: 20220097305
    Abstract: In one example in accordance with the present disclosure, a system is described. The system includes a reader to 1) read an identifier from a three-dimensional (3D) System printed object that includes a storage element and 2) read a location of the 3D printed object within a build material bed. An extractor of the system extracts, based on the identifier, a post processing operation to execute on the 3D printed object. A controller of the system controls a post processing operation based on extracted post processing operation information and the location.
    Type: Application
    Filed: June 18, 2019
    Publication date: March 31, 2022
    Applicant: Hewlett-Packard Development Company, L.P.
    Inventors: Kristopher J. Erickson, Jarrid Wittkopf, Rafael Ballagas, David Wayne George, Lihua Zhao, William J. Allen
  • Publication number: 20220097306
    Abstract: In one example in accordance with the present disclosure, a system is described. The system includes a reader to read an identifier from a storage element associated with a part. An extractor of the system extracts, based on the identifier, lifecycle conditions specific to the part. A controller of the system alters manufacturing operations based on extracted lifecycle conditions for the part.
    Type: Application
    Filed: June 18, 2019
    Publication date: March 31, 2022
    Applicant: Hewlett-Packard Development Company, L.P.
    Inventors: Kristopher J. Erickson, Jarrid Wittkopf, Rafael Ballagas, David Wayne George, Lihua Zhao, William J. Allen
  • Publication number: 20220101411
    Abstract: In one example in accordance with the present disclosure, a system is described. The system includes a reader to read an identifier associated with a part. An extractor of the system extracts, based on the identifier, sensor output data for the part. A transmitter of the system transmits a re-order request for the part based on the sensor output data.
    Type: Application
    Filed: June 18, 2019
    Publication date: March 31, 2022
    Applicant: Hewlett-Packard Development Company, L.P.
    Inventors: Kristopher J. Erickson, Jarrid Wittkopf, Rafael Ballagas, David Wayne George, Lihua Zhao, William J, Allen