Abstract: Example embodiments relate to a method and apparatus for reducing electrostatic deposition of charged particles on wetted surfaces that are exposed, periodically or substantially continuously, to high velocity fluid flow within a coolant flow path in a nuclear reactor. The method may include depositing a first or base dielectric layer and a second or outer dielectric layer on a conductive surface that forms a portion of a high velocity flow path to attain the apparatus. The first dielectric layer material is selected to provide improved adhesion and insulation to the conductive surface and the second dielectric layer material is selected to provide suitable adhesion to the first dielectric layer and improved corrosion and/or mechanical resistance in the anticipated operating environment.

Abstract: Example embodiments relate to a method and apparatus for reducing electrostatic deposition of charged particles on wetted surfaces that are exposed, periodically or substantially continuously, to high velocity fluid flow within a coolant flow path in a nuclear reactor. The method may include depositing a first or base dielectric layer and a second or outer dielectric layer on a conductive surface that forms a portion of a high velocity flow path to attain the apparatus. The first dielectric layer material is selected to provide improved adhesion and insulation to the conductive surface and the second dielectric layer material is selected to provide suitable adhesion to the first dielectric layer and improved corrosion and/or mechanical resistance in the anticipated operating environment.

Abstract: Disclosed is a method for reducing electrostatic deposition of charged particles on wetted surfaces that are exposed, periodically or substantially continuously to high velocity fluid flow within a coolant flow path in a nuclear reactor. The method includes depositing a first or base dielectric layer and a second or outer dielectric layer on a conductive surface that forms a portion of a high velocity flow path. The first dielectric layer material is selected to provide improved adhesion and insulation to the conductive surface and the second dielectric layer material is selected to provide suitable adhesion to the first dielectric layer and improved corrosion and/or mechanical resistance in the anticipated operating environment.

Abstract: Method and apparatus for surface conditioning a metal surface typically having irregular surface contours, by rubbing the metal surface with a surface conditioning device having a plurality of bristles which contact the metal surface during the rubbing and effect tensile stress reduction or degraded layer removal in the metal surface.

Abstract: Method and apparatus for surface conditioning a metal surface typically having irregular surface contours, by rubbing the metal surface with a surface conditioning device having a plurality of bristles which contact the metal surface during the rubbing and effect tensile stress reduction or degraded layer removal in the metal surface.

Abstract: A seal plate for repairing damaged areas in a pressure vessel cladding includes a first side and an opposing second side and a sealing portion located on the second side, with the sealing portion circumscribing the seal plate. The seal plate also includes a seal lip extending from a periphery of the sealing portion and a cavity located in the second side, with the cavity circumscribed by the sealing portion. The seal plate further includes at least one purge port extending from the first side to the cavity. Each purge port is in fluid communication with the cavity.