Patents by Inventor David Widlewski

David Widlewski has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Passivation glasses for semiconductor devices
    Patent number: 10370290
    Abstract: A passivation glass coating composition is provided for forming a fired passivation glass layer on a semiconductor substrate having p-n junction. The passivation glass coating composition includes a glass component that is lead free, cadmium free, alkali metal oxides free, and colored transition metal oxides (i.e. metal oxides of V, Fe, Co, Ni, Cr, Cu, Mn) free. The glass component includes bismuth based glasses, and provides a firing temperature range of 500° C. to 900° C., and controlled devitrification. Once fired to a semiconductor device, the fired passivation glass layer provides exceptional device performance including no cracking of the fired passivation glass layer, excellent thermal expansion matching to silicon, good chemical resistance to acid and base, and improved device performance.
    Type: Grant
    Filed: May 3, 2017
    Date of Patent: August 6, 2019
    Assignee: Ferro Corporation
    Inventors: Srinivasan Sridharan, John J. Maloney, George E. Sakoske, Gregory R. Prinzbach, David Widlewski, Jackie Davis, Bradford Smith
  • Passivation Glasses For Semiconductor Devices
    Publication number: 20190055155
    Abstract: A passivation glass coating composition is provided for forming a fired passivation glass layer on a semiconductor substrate having p-n junction. The passivation glass coating composition includes a glass component that is lead free, cadmium free, alkali metal oxides free, and colored transition metal oxides (i.e. metal oxides of V, Fe, Co, Ni, Cr, Cu, Mn) free. The glass component includes bismuth based glasses, and provides a firing temperature range of 500° C. to 900° C., and controlled devitrification. Once fired to a semiconductor device, the fired passivation glass layer provides exceptional device performance including no cracking of the fired passivation glass layer, excellent thermal expansion matching to silicon, good chemical resistance to acid and base, and improved device performance.
    Type: Application
    Filed: May 3, 2017
    Publication date: February 21, 2019
    Inventors: Srinivasan Sridharan, John J. Maloney, George E. Sakoske, Gregory R. Prinzbach, David Widlewski, Jackie Davis, Bradford Smith