Abstract: The method of making a metallized magnetic substrate for devices including a magnetic component involves providing an unfired ceramic body. In one exemplary embodiment, the method further involves making one or more vias through the ceramic body, coating the via side walls with conductive material, forming an aperture through the ceramic body, such that an aperture edge intersects the via, and metallizing the unfired ceramic body such that a conductive pathway is formed that includes the conductive material in the via. Finally, the metallized unfired ceramic body is fired in conventional fashion, optionally followed by deposition of additional conductor material.

Abstract: The present invention provides improved techniques for metallizing ceramic substrates. The method comprises providing a ceramic substrate and depositing a layer of reducible material on the ceramic substrate. The layer of reducible material includes a reducible ceramic such as copper oxide. The ceramic substrate having the layer of reducible material disposed thereon is heated and the reducible material is contacted with a reducing agent to create a conductive region. The conductive region is either a metallized region formed by reduction, or it is a conductive ceramic formed through surface reduction. The present invention further provides a metallized ceramic substrate. The metallized layer comprises ceramic regions having at least one constituent in common with the ceramic substrate. The ceramic substrate and the ceramic regions of the metallized layer are sintered to each other such that the metallized region is interspersed between the sintered ceramic regions.

Abstract: Conventional optical gratings are relatively temperature sensitive. This sensitivity is generally undesirable but can be reduced or eliminated by attaching the grating to a support member having a negative coefficient of thermal expansion. Exemplarily the member comprises Zr-tungstate and/or Hf-tungstate. The thermal expansion can be tailored by admixture of positive expansion coefficient material (e.g., Al.sub.2 O.sub.3, SiO.sub.2) to the negative expansion coefficient material (e.g., ZrW.sub.2 O.sub.8), or by a variety of other techniques.