Patents by Inventor David William Garrett

David William Garrett has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Thermal barrier composition
    Patent number: 7687150
    Abstract: The thermal barrier composition of the present invention provides a glassy matrix comprising an alkoxy-functionalized siloxane and a functionally-terminated silane or siloxane, polymethylsilsesquioxane dissolved in a crosslinking agent, and optionally a filler and/or hollow glass microspheres.
    Type: Grant
    Filed: January 3, 2006
    Date of Patent: March 30, 2010
    Assignee: Microphase Coatings, Inc.
    Inventors: William H. Simendinger, III, David William Garrett
  • Thermal barrier composition
    Publication number: 20040260018
    Abstract: The thermal barrier composition of the present invention provides a glassy matrix comprising an alkoxy-functionalized siloxane and a functionally-terminated silane or siloxane, polymethylsilsesquioxane dissolved in a crosslinking agent, and optionally a filler and/or hollow glass microspheres.
    Type: Application
    Filed: March 31, 2004
    Publication date: December 23, 2004
    Inventors: William H. Simendinger, David William Garrett
  • Anti-corrosion composition
    Publication number: 20040099845
    Abstract: The present invention provides an anti-corrosion composition which can be applied to various substrates. The composition comprises a glass matrix formed by crosslinking a mixture of an amine-functionalized silane and an alkoxy-functionalized siloxane, an epoxy and a compatabilizing agent for coupling the epoxy and the alkoxy-functionalized siloxane of the glass matrix.
    Type: Application
    Filed: October 7, 2003
    Publication date: May 27, 2004
    Inventors: William H. Simendinger, David William Garrett, Shawn D. Miller
  • NOVEL HARDENER FOR EPOXY MOLDING COMPOUNDS
    Publication number: 20020128354
    Abstract: The invention is directed to novel epoxy molding compounds for the encapsulation of microchips in the electronics industry. Known epoxy molding encapsulants are generally prepared from a blend epoxy resins, phenol hardeners, silica fillers, catalysts, flame retardant materials, processing aids and colorants. The addition of polybenzoxazines as a co-reactant with one or several epoxy resins provides a product with reduced moisture adsorption while maintaining a high glass transition temperature.
    Type: Application
    Filed: January 5, 2001
    Publication date: September 12, 2002
    Inventor: David William Garrett
  • Hardener for epoxy molding compounds
    Patent number: 6437026
    Abstract: The invention is directed to novel epoxy molding compounds for the encapsulation of microchips in the electronics industry. Known epoxy molding encapsulants are generally prepared from a blend epoxy resins, phenol hardeners, silica fillers, catalysts, flame retardant materials, processing aids and colorants. The addition of polybenzoxazines as a co-reactant with one or several epoxy resins provides a product with reduced moisture adsorption while maintaining a high glass transition temperature.
    Type: Grant
    Filed: January 5, 2001
    Date of Patent: August 20, 2002
    Assignee: Cookson Singapore PTE Ltd.
    Inventor: David William Garrett
  • Polyphthalamide composition
    Patent number: 6306951
    Abstract: Filled and unfilled polyamide compositions of improved toughness comprise a polyamide component comprising recurring aliphatic terephthalamide units and a modifying component comprising a functionalized block copolymer comprising styrene polymer blocks and rubber blocks comprising ethylene/propylene, ethylene/butylene, or ethylene/pentylene polymer blocks or a combination thereof.
    Type: Grant
    Filed: June 3, 1994
    Date of Patent: October 23, 2001
    Assignee: BP Corporation North America Inc.
    Inventors: Ruth Ann Montag, George Albert Corbin, David William Garrett
  • Epoxy mold compound and method
    Patent number: 6214905
    Abstract: Mold compounds for encapsulating semiconductors are disclosed. The compounds achieve high levels of adhesion to uncleaned printed wiring board substrates by minimizing the level of silicone fluid in the compound. Methods for encapsulating semiconductor dies and processes for encapsulating the dies also are disclosed.
    Type: Grant
    Filed: November 24, 1998
    Date of Patent: April 10, 2001
    Assignee: Cookson Singapore PTE LTD c/o Alpha Metals, Inc.
    Inventor: David William Garrett