Patents by Inventor David William Grunow
David William Grunow has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240235258Abstract: An information handling system includes a bottom case and a wireless charging puck. The bottom case includes a bay. The wireless charging puck fits into the bay, and is detachable from the bottom case. When the wireless charging puck is fitted into the bay, the wireless charging puck is configured as a power receiving unit to receive wireless power. When the wireless charging puck is detached from the bay, the wireless charging puck is configured as a power transmitting unit to provide wireless power to an external device.Type: ApplicationFiled: October 19, 2022Publication date: July 11, 2024Inventors: Andrew Sultenfuss, Jennifer Davis, David William Grunow
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Patent number: 12029006Abstract: Methods and systems for thermally managing data processing systems are disclosed. Data processing systems may provide computer implemented services to users thereof and/or other devices. The data processing systems may include various hardware components that perform computations used to provide the computer implemented services and may generate heat as a byproduct. To dissipate the heat generated by the hardware components, airflows proximate to the hardware components may be used to extract the heat. Once extracted, the heated airflows may be exhausted from the data processing systems. To facilitate use of the exhausted airflows, the airflows may be selectively directed in accordance with user preferences.Type: GrantFiled: July 22, 2022Date of Patent: July 2, 2024Assignee: Dell Products L.P.Inventors: Steven L. Williams, David William Grunow, Qinghogn He
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Publication number: 20240136852Abstract: An information handling system includes a bottom case and a wireless charging puck. The bottom case includes a bay. The wireless charging puck fits into the bay, and is detachable from the bottom case. When the wireless charging puck is fitted into the bay, the wireless charging puck is configured as a power receiving unit to receive wireless power. When the wireless charging puck is detached from the bay, the wireless charging puck is configured as a power transmitting unit to provide wireless power to an external device.Type: ApplicationFiled: October 18, 2022Publication date: April 25, 2024Inventors: Andrew Sultenfuss, Jennifer Davis, David William Grunow
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Publication number: 20240032239Abstract: Methods and systems for thermally managing data processing systems are disclosed. Data processing systems may provide computer implemented services to users thereof and/or other devices. The data processing systems may include various hardware components that perform computations used to provide the computer implemented services and may generate heat as a byproduct. To dissipate the heat generated by the hardware components, airflows proximate to the hardware components may be used to extract the heat. Once extracted, the heated airflows may be exhausted from the data processing systems. To facilitate use of the exhausted airflows, the airflows may be selectively directed in accordance with user preferences.Type: ApplicationFiled: July 22, 2022Publication date: January 25, 2024Inventors: STEVEN L. WILLIAMS, David William Grunow, QINGHOGN HE
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Patent number: 11794388Abstract: Forming a casing of an information handling system using dual area bi-injection, the method including injecting a first material into a mold: i) at first locations of the mold to form a first portion of a casing, and ii) at second locations of the mold to form a second portion of the casing; and injecting a second material into the mold at third locations of the mold to form a third portion of the casing; wherein injection of the first material and the second material into the mold is done concurrently, wherein injection of the first and the second material into the mold forms a first bonding interface and a second bonding interface between the first material and the second material such that the second material is excluded from ingression to the first portion and the second portion of the casing.Type: GrantFiled: June 2, 2022Date of Patent: October 24, 2023Assignee: Dell Products L.P.Inventors: Yonghong Duan, David William Grunow, David Wheeler Williams, Patrick A. Hampton, Anthony Wayne Howard
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Publication number: 20230070036Abstract: In one or more embodiments, one or more systems, one or more methods, and/or one or more processes may determine a temperature value within a chassis of an information handling system (IHS); may determine an ambient temperature value outside the chassis based at least on the temperature value within the chassis; may provide the ambient temperature value outside the chassis to a process executing on the IHS; may determine a threshold temperature value associated with at least one processor of the IHS based at least on the ambient temperature value outside the chassis and based at least on a target skin temperature value of the IHS; and may configure the at least one processor based at least on the threshold temperature value associated with the at least one processor.Type: ApplicationFiled: September 3, 2021Publication date: March 9, 2023Inventors: Qinghong He, Adolfo Sandor Montero, Steven Leon Williams, David William Grunow
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Patent number: 9261924Abstract: Heat pipe assemblies for Information Handling Systems (IHSs). In some embodiments, an IHS may comprise a motherboard including a Central Processing Unit (CPU); a cooling system coupled to the motherboard, the cooling system including a heat pipe, the CPU coupled to a first side of the heat pipe; and a daughterboard coupled to the motherboard and including a Graphics Processing Unit (GPU) coupled to a second side of the heat pipe. In other embodiments, a method may include providing a motherboard including a CPU; coupling a cooling system to the motherboard, the cooling system including a heat pipe, the CPU coupled to a first side of the heat pipe; and coupling a daughterboard to the motherboard, the daughterboard including a GPU coupled to a second side of the heat pipe.Type: GrantFiled: September 5, 2013Date of Patent: February 16, 2016Assignee: DELL INC.Inventors: David William Grunow, Daniel William Kehoe, Matthew B. Mendelow
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Publication number: 20150062802Abstract: Heat pipe assemblies for Information Handling Systems (IHSs). In some embodiments, an IHS may comprise a motherboard including a Central Processing Unit (CPU); a cooling system coupled to the motherboard, the cooling system including a heat pipe, the CPU coupled to a first side of the heat pipe; and a daughterboard coupled to the motherboard and including a Graphics Processing Unit (GPU) coupled to a second side of the heat pipe. In other embodiments, a method may include providing a motherboard including a CPU; coupling a cooling system to the motherboard, the cooling system including a heat pipe, the CPU coupled to a first side of the heat pipe; and coupling a daughterboard to the motherboard, the daughterboard including a GPU coupled to a second side of the heat pipe.Type: ApplicationFiled: September 5, 2013Publication date: March 5, 2015Applicant: Dell Products, L.P.Inventors: David William Grunow, Daniel William Kehoe, Matthew B. Mendelow
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Patent number: 7815228Abstract: A system, apparatus, and method for damping vibration of an elastic member within a latch for securing a top panel to a base of an information handling system (IHS) includes an elastic member with a first end and a second end, the first end attached to a fixed portion of the top panel. The latch may further include a body attachable to the top panel, the body defining a cavity for receiving the elastic member, wherein the body further comprises a movable anchor for attaching the second end of the elastic member and a raised portion, wherein the raised portion is in contact with the elastic member within the cavity to damp vibration of the elastic member. The latch further includes an actuation tab coupled to the body to engage the body in a movable position.Type: GrantFiled: November 2, 2007Date of Patent: October 19, 2010Assignee: Dell Products L.P.Inventors: David William Grunow, Richard C. Sohaney, Faiza Hassan, Anil Damani
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Patent number: 7639491Abstract: An optical drive apparatus includes a drive tray including an optical drive mechanism, whereby the drive tray is operable to be inserted directly into an information handling system drive bay free of a drive chassis. An information handling system chassis may be provided that accepts the optical drive apparatus and couples the optical drive apparatus to the information handling system without the need of a drive chassis.Type: GrantFiled: March 29, 2006Date of Patent: December 29, 2009Assignee: Dell Products, L.P.Inventors: Kevin Mundt, David William Grunow, Faiza Hassan, Scott Koester, Reynold L. Liao, Jefferson Wirtz
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Publication number: 20090115197Abstract: The disclosure provides a system, apparatus, and method for damping vibration of an elastic member within a latch for securing a top panel to a base of an information handling system (IHS) wherein the latch includes an elastic member with a first end and a second end, the first end attached to a fixed portion of the top panel. The latch may further include a body attachable to the top panel, the body defining a cavity for receiving the elastic member, wherein the body further comprises a movable anchor for attaching the second end of the elastic member and a raised portion, wherein the raised portion is in contact with the elastic member within the cavity to damp vibration of the elastic member and an actuation tab coupled to the body to engage the body in a movable position.Type: ApplicationFiled: November 2, 2007Publication date: May 7, 2009Applicant: DELL PRODUCTS L.P.Inventors: David William Grunow, Richard C. Sohaney, Faiza Hassan, Anil Damani
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Patent number: 6687120Abstract: A computer system includes a speaker-antenna assembly in the base of the system. Multiple speaker-antenna assemblies are situated in spaced apart relationship in the base in one embodiment. This provides both audio separation and isolation between the antennas for space and frequency diversity operation. By locating the speaker and antenna in a common assembly, substantial space savings are achieved.Type: GrantFiled: October 17, 2001Date of Patent: February 3, 2004Assignee: Dell Products L.P.Inventors: Chuck Hood, David William Grunow
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Publication number: 20030072131Abstract: A computer system includes a speaker-antenna assembly in the base of the system. Multiple speaker-antenna assemblies are situated in spaced apart relationship in the base in one embodiment. This provides both audio separation and isolation between the antennas for space and frequency diversity operation. By locating the speaker and antenna in a common assembly, substantial space savings are achieved.Type: ApplicationFiled: October 17, 2001Publication date: April 17, 2003Applicant: Dell Products, LPInventors: Chuck Hood, David William Grunow
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Patent number: 6259601Abstract: A docking device for a portable computer including an enclosure having a support surface for supporting a portable computer thereon. An orifice plate is attached to the enclosure adjacent to the support surface. The orifice plate includes a plurality of orifices formed therethrough and the orifice plate is recessed with respect to the support surface. An air duct including an outlet portion is attached to an interior portion of the enclosure adjacent to the orifice plate. A blower is attached to an inlet portion of the air duct. The blower is operable to pressurize the air duct such that air is expelled through the orifices. The embodiments of the present disclosure reduce the skin temperature of the computer and the operating temperature of heat generating internal components. In addition, the processor can be operated at higher speeds for longer periods of time.Type: GrantFiled: September 30, 1999Date of Patent: July 10, 2001Assignee: Dell USA, L.P.Inventors: Christopher Michael Jaggers, Cassius Joseph Mullen, David William Grunow